技术领域

专利数量

占比（%）

1

半导体制造

396

4.3%

2

材料化学与纳米

232

2.4%

3

电【我.爱.线.报.网.】气元件与电路

224

0.9%

4

半导体元器件

98

0.5%

5

金属成型加工

54

0.5%

6

半导体集成电路

47

0.5%

7

光学与摄影

62

0.4%

8

材料测试

21

0.2%

9

分离与混合加工

25

0.2%

10

包装与储运

16

0.2%

11

物理测量

23

0.2%

12

非金属成型加工

17

0.2%

13

光电测量与核物理

18

0.1%

14

制冷制热与照明

13

0.1%

15

物理信号与控制

20

0.1%

16

一般机械与武器

14

0.1%

17

电池

5

0.1%

18

有机化学

9

0.1%

19

化工

7

0.1%

20

图像处理

10

0.1%

Patent No.

Title

Inventors

11214890

Cleaning components and methods in a plating system

Hanson Kyle M.

11215934

In-situ light【我.爱.线.报.网.】 detection methods and apparatus for ultraviolet semiconductor substrate processing

Antonio Ralph Peter; Sheng Shuran; Zhang Lin; Werner Joseph C.

11217427

System, apparatus and method for bunched ribbon ion beam

Renau Anthony

11217433

Rotary union with mechanical seal assembly

Mitchell Robert J.; Colom Gu【我.爱.线.报.网.】illermo

11217443

Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substrates

Vats Vinayak Veer; Yu Hang; Kraus Philip Allan; Kamath Sanjay G.; Durand William John; Kalutarage Lakmal Charidu; Mallick Abhijit B.; Li Changling; Padhi Deenesh; Saly M【我.爱.线.报.网.】ark Joseph; Chua Thai Cheng; Balseanu Mihaela A.

11217448

Methods for reducing transfer pattern defects in a semiconductor device

Freed Regina; Sherman Steven R.; Alexis Nadine; Zhou Lin

11217462

Bolted wafer chuck thermal management systems and methods for wafer processing systems

Benjaminson David; Lubo【我.爱.线.报.网.】mirsky Dmitry; Math Ananda Seelavanth; Natarajan Saravanakumar; Chourey Shubham

11217536

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Park Jungrae; Lei Wei-Sheng; Eaton Brad; Papanu James S.; Kumar Ajay

11220746

Half-angle nozzle

Shono Eric Kihara

11220747

C【我.爱.线.报.网.】omplementary pattern station designs

AuBuchon Joseph; Baluja Sanjeev; Rice Michael; Dan Arkaprava; Chen Hanhong

11221182

Apparatus with multistaged cooling

Gajendra Manoj A.; Subramanian Arul Vasanth

11222769

Monopole antenna array source with gas supply or grid filter for semiconductor process equipment

L【我.爱.线.报.网.】iang Qiwei; Nemani Srinivas D.

11222771

Chemical control features in wafer process equipment

Liang Qiwei; Sharma Rohit; Qiao Jingyu

11222809

Patterned vacuum chuck for double-sided processing

Yudovsky Joseph; Sivaramakrishnan Visweswaren; Godet Ludovic; Meyer Timmerman Thijssen Rutger

11222816

Methods and a【我.爱.线.报.网.】pparatus for semi-dynamic bottom up reflow

Zhong Lanlan; Pethe Shirish A.; Zhang Fuhong; Lee Joung Joo; Kalathiparambil Kishor; Xie Xiangjin; Tang Xianmin

11225027

Melt pool monitoring in multi-laser systems

Raghavan Kamala Chakravarthy; Franklin Jeffrey L.

11226234

Spectrum shaping devices and techniques【我.爱.线.报.网.】 for optical characterization applications

Zhao Guoheng; Budiarto Edward W.; Egan Todd J.

11226439

System and method for forming surface relief gratings

Olson Joseph C.; Godet Ludovic; Biloiu Costel

11226440

Mask orientation

Xu Yongan; Meyer Timmerman Thijssen Rutger; Guo Jinrui; Godet Ludovic

11226441

Metho【我.爱.线.报.网.】ds of producing slanted gratings with variable etch depths

Evans Morgan; Meyer Timmerman Thijssen Rutger; Olson Joseph C.

11226556

Patterning of multi-depth optical devices

Godet Ludovic; Chen Chien-An; Cohen Brian Alexander; McMillan Wayne; McMackin Ian Matthew

11227193

Automated image measurement for pr【我.爱.线.报.网.】ocess development and optimization

Kumar Abhinav; Schwarz Benjamin; Hardy Charles

11227746

Isolated backside helium delivery system

Bonecutter Luke; Kangude Abhijit

11227751

Plasma chamber target for reducing defects in workpiece during dielectric sputtering

Wang Xiaodong; Lei Jianxin; Wang Rongjun

11227797【我.爱.线.报.网.】

Film deposition using enhanced diffusion process

Jiang Shishi; Leschkies Kurtis; Manna Pramit; Mallick Abhijit

11230761

Deposition system with a multi-cathode

Jindal Vibhu; Bhat Sanjay

11230763

Gas separation control in spatial atomic layer deposition

Li Ning; Marcus Steven D.; Ngo Tai T.; Griffin Kevin

112【我.爱.线.报.网.】30793

Mechanically-driven oscillating flow agitation

McHugh Paul R.; Wilson Gregory J.

11232561

Capture and storage of magnified images

Prabhudesai Parijat P.; Raghunathan Ganesh Kumar Mohanur; Sista Aditya; Jha Sumit Kumar; Chandan Narasimha Murthy

11232925

System and method for improved beam current from【我.爱.线.报.网.】 an ion source

Chang Shengwu; Sinclair Frank; St. Peter Michael

11232930

Method and device for a carrier proximity mask

Evans Morgan; Carlson Charles T.; Meyer Timmerman Thijssen Rutger; Bandy Ross; Magee Ryan

11232933

Temperature and bias control of edge ring

Rogers James; Cui Linying; Dhindsa Rajinder

112【我.爱.线.报.网.】32951

Method and apparatus for laser drilling blind vias

Lei Wei-Sheng; Leschkies Kurtis; Gouk Roman; Verhaverbeke Steven; Sivaramakrishnan Visweswaren

11232955

Methods of etching metal oxides with less etch residue

Mullick Amrita B.; Mallick Abhijit Basu; Gandikota Srinivas; Roy Susmit Singha; Rao Yingl【我.爱.线.报.网.】i; Freed Regina; Mitra Uday

11232965

Transport system

Newman Jacob; Oldendorf Ulrich; Aenis Martin; Constant Andrew J.; Assaf Shay; Hudgens Jeffrey C.; Berger Alexander; Weaver William Tyler

11236415

Deposition system with shield mount

Jindal Vibhu; Bhat Sanjay

11236418

Bottom-up growth of silicon oxide and【我.爱.线.报.网.】 silicon nitride using sequential deposition-etch-treat processing

Cheng Rui; Mallick Abhijit Basu; Manna Pramit

11236424

Process kit for improving edge film thickness uniformity on a substrate

Mustafa Muhannad; Rasheed Muhammad M

11236834

Diaphragm valves and methods of operating same

Le Kenneth; Mohammed【我.爱.线.报.网.】 Balarabe; Zokaei Sohrab; Xu Ming

11237473

Physical vapor deposition system and processes

Jindal Vibhu; Xiao Wen; Bhat Sanjay

11237485

System, software application, and method for lithography stitching

Xu Yongan; Bencher Christopher Dennis; Visser Robert Jan; Godet Ludovic

11239040

Thermally isolated repell【我.爱.线.报.网.】er and electrodes

McLaughlin Adam M.; Chaney Craig R.; Tye Jordan B.

11239058

Protective layers for processing chamber components

Balaraman Karthikeyan; Ramasamy Balamurugan; Shah Kartik; Larsson Mats; Papke Kevin A.; Patibandla Rajasekhar; Bindiganavale Sathyanarayana; Kelkar Umesh M.

11239061

Methods an【我.爱.线.报.网.】d systems to enhance process uniformity

Singh Saravjeet; Tso Alan; Zhang Jingchun; Li Zihui; Zhang Hanshen; Lubomirsky Dmitry

11239086

Back end memory integration process

Tseng Hsin-wei; Pakala Mahendra; Xue Lin; Ahn Jaesoo; Amin Hassan Sajjad

11239091

Etching of metal oxides using fluorine and metal hali【我.爱.线.报.网.】des

Woods Keenan N.; Cui Zhenjiang; Saly Mark

11239213

In-situ curing of color conversion layer in recess

Zhang Daihua; Luo Yingdong; Zhu Mingwei; Ng Hou T.; Ganapathiappan Sivapackia; Patibandla Nag B.

11239258

High-k dielectric materials comprising zirconium oxide utilized in display devices

Rui Xiangxin【我.爱.线.报.网.】; Zhao Lai; Chen Jrjyan Jerry; Choi Soo Young; Zhai Yujia

11241718

Cleaning components and methods in a plating system

Jonathan Joseph Antony; Hanson Kyle M.; Rye Jason A.; Brown James E.; Wilson Gregory J.; Bergman Eric J.; Youngbull Tricia A.; Stolt Timothy G.

11241769

Methods and apparatus for profile【我.爱.线.报.网.】 and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Ishikawa David Masayuki; Oh Jeonghoon; Sin Garrett Ho Yee; Garretson Charles C.; Zhang Huanbo; Pai Chia-Ling; Prasad Niraj; Muzquiz Julio David

11241839

Integrating 3D printing into multi-process fabrication【我.爱.线.报.网.】 schemes

McClintock William H.; Bajaj Rajeev; Fung Jason G.; Redfield Daniel

11242599

Particle coating methods and apparatus

Gangakhedkar Kaushal; Frankel Jonathan; Neikirk Colin C.; Narwankar Pravin K.

11242600

High temperature face plate for deposition application

Bansal Amit Kumar; Rathi Saket; Nguyen T【我.爱.线.报.网.】uan Anh

11243480

System for making accurate grating patterns using multiple writing columns each making multiple scans

Markle David; Jeong Hwan J.

11244808

Monopole antenna array source for semiconductor process equipment

Liang Qiwei; Nemani Srinivas D.

11244811

Plasma reactor with highly symmetrical four-f【我.爱.线.报.网.】old gas injection

Rozenzon Yan; Tantiwong Kyle; Yousif Imad; Knyazik Vladimir; Keating Bojenna; Banna Samer

11244824

Conformal doped amorphous silicon as nucleation layer for metal deposition

Cheng Rui; Chen Yihong; Wu Yong; Mallick Abhijit Basu; Gandikota Srinivas

11244844

High flow velocity, gas-purged,【我.爱.线.报.网.】 side storage pod apparatus, assemblies, and methods

Reuter Paul B.; Narasimhan Murali; Athayde Amulya L.; Pannese Patrick; Hruzek Dean C.; Merry Nir

11244846

Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic devic【我.爱.线.报.网.】e manufacturing

Hudgens Jeffrey C.; Rice Michael R.; Muthukamatchi Karuppasamy; Merry Nir

11245022

Integrated dipole flow for transistor

Lin Yongjing; Bernal Ramos Karla M.; Li Luping; Chen Shih Chung; Wrench Jacqueline S.; Yang Yixiong; Hung Steven C. H.; Gandikota Srinivas; Yoshida Naomi; Dong Lin

1124【我.爱.线.报.网.】5069

Methods for forming structures with desired crystallinity for MRAM applications

Xue Lin; Ahn Jaesoo; Pakala Mahendra; Ching Chi Hong; Wang Rongjun

11247298

Method of forming a plurality of gratings

Evans Morgan; Olson Joseph C.; Meyer Timmerman Thijssen Rutger

11249067

Nanopore flow cells and methods 【我.爱.线.报.网.】of fabrication

Johnson Joseph R.; Quon Roger

11249386

Extreme ultraviolet mask with backside coating

Jindal Vibhu; Chandrachood Madhavi R; Banthia Vikash

11249388

Extreme ultraviolet mask absorber materials

Liu Shuwei; Jindal Vibhu

11249389

Extreme ultraviolet mask absorber materials

Liu Shuwei; Jindal Vibhu

1【我.爱.线.报.网.】1249390

Extreme ultraviolet mask absorber materials

Liu Shuwei; Jindal Vibhu; Chong Halbert

11251010

Shaped repeller for an indirectly heated cathode ion source

Perel Alexander S.; Johnson Jay S.; Madunts Suren; McLaughlin Adam M.; Wright Graham

11251023

Multi-layer plasma resistant coating by atomic layer【我.爱.线.报.网.】 deposition

Wu Xiaowei; Fenwick David; Sun Jennifer Y.; Zhan Guodong

11251024

Coating for chamber particle reduction

Tseng Hsin-wei; Madsen Casey Jane; Chen Yikai; Wysok Irena; Chong Halbert

11251028

Pre-clean chamber with integrated shutter garage

Tsai Cheng-Hsiung Matt; Jupudi Ananthkrishna; Babu Sarath;【我.爱.线.报.网.】 Koppa Manjunatha P.; Takahama Hiroyuki

11251047

Clog detection in a multi-port fluid delivery system

Nangoy Roy C.; Pollard Chad; DAmbra Allen L.

11251067

Pedestal lift for semiconductor processing chambers

West Brian T.; Gelo Miroslav; Rozenzon Yan; Johnson Roger M.; Covington Mark; Jembulingam Soundarr【我.爱.线.报.网.】ajan; Binns Simon Nicholas; Vinit Vivek

11251226

Systems and methods for transfer of micro-devices

Zhu Mingwei; Ganapathiappan Sivapackia; Fu Boyi; Ng Hou T.; Patibandla Nag B.

11251364

Magnetic tunnel junctions suitable for high temperature thermal processing

Xue Lin; Ching Chi Hong; Ahn Jaesoo; Pakala M【我.爱.线.报.网.】ahendra; Wang Rongjun

11255785

Identifying fiducial markers in fluorescence microscope images

Chang Yun-Ching

11257677

Methods and devices for subtractive self-alignment

Ren He; Jiang Hao; Naik Mehul; Hou Wenting; Lei Jianxin; Gong Chen; Cao Yong

11257693

Methods and systems to improve pedestal temperature 【我.爱.线.报.网.】control

Nguyen Son; Lubomirsky Dmitry; Kim Chungman; Floyd Kirby H.

11257698

Selective etch rate monitor

Kraus Philip Allan; Franklin Timothy Joseph

11257790

High connectivity device stacking

Leschkies Kurtis; Chen Han-Wen; Verhaverbeke Steven; Park Giback; Cho Kyuil; Franklin Jeffrey L.; Lei Wei-Sheng

1125【我.爱.线.报.网.】8045

Methods of forming stretchable encapsulation for electronic displays

Cho Kyuil; Kwak Byung Sung; Visser Robert Jan

11260432

In-situ DC plasma for cleaning pedestal heater

Ulavi Tejas; Dan Arkaprava; Baluja Sanjeev; Tang Wei V.

11260498

Method of polishing a new or a refurbished electrostatic chuck

Lu W【我.爱.线.报.网.】illiam Ming-ye; Boyd, Jr. Wendell Glen; Meyer Stacy

11260500

Retaining ring with shaped surface

Chen Hung Chih; Zuniga Steven M.; Garretson Charles C.; McAllister Douglas R.; Lin Jian; Meyer Stacy; Huey Sidney P.; Oh Jeonghoon; Doan Trung T.; Schmidt Jeffrey P.; Wohlert Martin S.; Hughes Kerry F.; Wang【我.爱.线.报.网.】 James C.; Lu Danny Cam Toan; De Lamenie Romain Beau; Balagani Venkata R.; Allen Aden Martin; Fong Michael Jon

11261525

Injector for batch processing and methods of use

Yudovsky Joseph; Griffin Kevin; Sriram Mandyam

11261533

Aluminum plating at low temperature with high efficiency

Groechel David W.; Peng 【我.爱.线.报.网.】Gang; Mikkola Robert

11261538

In-situ temperature mapping for epi chamber

Moradian Ala; Zhu Zuoming; Liu Patricia M.; Lau Shu-Kwan; Chang Flora Fong-Song; Choo Enle; Ye Zhiyuan

11262250

Method for measuring a temperature

Weber Heiko

11262662

Post exposure processing apparatus

Babayan Viachslav; Godet Ludovic【我.爱.线.报.网.】; Hanson Kyle M.; Moore Robert B.

11264205

Techniques for determining and correcting for expected dose variation during implantation of photoresist-coated substrates

Wilson Eric Donald; Gammel George

11264213

Chemical control features in wafer process equipment

Liang Qiwei; Chen Xinglong; Chuc Kien; Lubom【我.爱.线.报.网.】irsky Dmitry; Park Soonam; Yang Jang-Gyoo; Venkataraman Shankar; Tran Toan; Hinckley Kimberly; Garg Saurabh

11264252

Chamber lid with integrated heater

Willwerth Michael D.; Ludwig Jeffrey; Schwarz Benjamin; Cotlear Roberto Cesar

11264258

Buffer chamber wafer heating mechanism and supporting robots

Weaver【我.爱.线.报.网.】 William T.; Schaller Jason M.; Vopat Robert Brent; Blahnik David; Riordon Benjamin B.; Pergande Paul E.

11264261

High temperature electrostatic chuck bonding adhesive

Sun Jennifer Y.; Thach Senh; Duan Ren-Guan

11264263

Conveyor inspection system, substrate rotator, and test system having the same

Schlezi【我.爱.线.报.网.】nger Asaf; Stopper Markus J.

11264331

Package structure and fabrication methods

Chen Han-Wen; Verhaverbeke Steven; Park Giback; Cellere Giorgio; Tonini Diego; Dicaprio Vincent; Cho Kyuil

11264333

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Chen Han-Wen【我.爱.线.报.网.】; Verhaverbeke Steven; See Guan Huei; Park Giback; Cellere Giorgio; Tonini Diego; Dicaprio Vincent; Cho Kyuil

11264460

Vertical transistor fabrication for memory applications

Kumar Arvind; Manhas Sanjeev; Pakala Mahendra; Yieh Ellie Y.

11265971

Sensor system for multi-zone electrostatic chuck

Parkhe Vijay【我.爱.线.报.网.】 D.

11268208

Electroplating system

McHugh Paul R; Wilson Gregory J; Hanson Kyle M; Klocke John L; Valkenburg Paul Van; Bergman Eric J; McClure Adam Marc; Kalaikadal Deepak Saagar; Zimmerman Nolan Layne; Windham Michael; Borjesson Mikael R

11270864

Apparatus and system including extraction optics having m【我.爱.线.报.网.】ovable blockers

Biloiu Costel; Calkins Adam; Kontos Alexander C.; Howarth James J.

11270870

Processing equipment component plating

Duan Ren-Guan; Rocha-Alvarez Juan Carlos; Afzal Bushra

11270898

Apparatus for enhancing flow uniformity in a process chamber

Ramalingam Jothilingam; Savandaiah Kirankumar Neela【我.爱.线.报.网.】sandra; Zhang Fuhong; Johanson William

11270903

Multi zone electrostatic chuck

Mutyala Madhu Santosh Kumar; Kamath Sanjay; Padhi Deenesh

11270905

Modulating film properties by optimizing plasma coupling materials

Venkatasubramanian Eswaranand; Haywood Edward L.; Gottheim Samuel E.; Manna Pramit; Chuc Kien【我.爱.线.报.网.】 N.; Fischbach Adam; Mallick Abhijit B.; Franklin Timothy J.

11271097

Cap oxidation for FinFET formation

Hung Steven C.; Colombeau Benjamin; Dube Abhishek; Kung Sheng-Chin; Liu Patricia M.; Bevan Malcolm J.; Swenberg Johanes

11274368

Apparatus for selective gas injection and extraction

Ripley Martin J.

112【我.爱.线.报.网.】74377

Seal apparatus for an electroplating system

Hanson Kyle M.; Adagoor Manjunatha Vishwanatha; Balaraman Karthikeyan; Vasu Karthick; Chouriya Shailesh

11275360

Using graphics processing unit for substrate routing and throughput modeling

Emani Shyam Sunder

11275975

Fault detection classification

Cantwell 【我.爱.线.报.网.】Dermot

11276559

Semiconductor processing chamber for multiple precursor flow

Samir Mehmet Tugrul; Yang Dongqing; Lubomirsky Dmitry; Hillman Peter; Park Soonam; Choy Martin Yue; Zhu Lala

11276562

Plasma processing using multiple radio frequency power feeds for improved uniformity

Ye Zheng John; Balasubrama【我.爱.线.报.网.】nian Ganesh; Britcher Thuy; Pinson, II Jay D.; Hanawa Hiroji; Rocha-Alvarez Juan Carlos; Lee Kwangduk Douglas; Seamons Martin Jay; Kim Bok Hoen; Ha Sungwon

11276569

On stack overlay improvement for 3D NAND

Lin Yongjing; Gung Tza-Jing; Ogata Masaki; Zhou Yusheng; Han Xinhai; Padhi Deenesh; Rocha Juan Ca【我.爱.线.报.网.】rlos; Bansal Amit Kumar; Srinivasan Mukund

11276570

Multi-layer deposition and treatment of silicon nitride films

Vats Vinayak Veer; Ahn Byung Kook; Lee SeoYoung; Yu Hang

11276573

Methods of forming high boron-content hard mask materials

Qi Bo; Shen Zeqing; Mallick Abhijit

11276590

Multi-zone semiconductor 【我.爱.线.报.网.】substrate supports

Samir Mehmet Tugrul; Yang Dongqing; Lubomirsky Dmitry; Hillman Peter; Park Soonam; Choy Martin Yue; Zhu Lala

11276594

Systems, apparatus, and methods for an improved load port backplane

Reuter Paul B.; Baumgarten Douglas B.

11276601

Apparatus and methods for manipulating power at an edg【我.爱.线.报.网.】e ring in a plasma processing device

Cui Linying; Rogers James

11276886

Solid state battery fabrication

Herle Subramanya P.; Gordon, II Joseph G.

11279032

Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots

Bergantz Nicholas Michael; Pehlivan Ali Utku

11279656

Nanopowder【我.爱.线.报.网.】s, nanoceramic materials and methods of making and use thereof

Zhan Guodong; Wu Xiaowei; He Xiao Ming; Sun Jennifer Y.

11279661

Heat treated ceramic substrate having ceramic coating

Sun Jennifer Y.; Duan Ren-Guan; Kanungo Biraja P.; Lubomirsky Dmitry

11280686

Temperature measurement using etalons

Howells S【我.爱.线.报.网.】amuel C.; Adams Bruce E.

11280717

Methods and apparatus for detection and analysis of nanoparticles from semiconductor chamber parts

Goradia Prerna; Ghosh Avishek; Visser Robert Jan

11281094

Method for via formation by micro-imprinting

Gouk Roman; Park Giback; Cho Kyuil; Chen Han-Wen; Buch Chintan; Verhav【我.爱.线.报.网.】erbeke Steven; Dicaprio Vincent

11282676

Paired dynamic parallel plate capacitively coupled plasmas

Ponnekanti Hari; Tanaka Tsutomu; Sriram Mandyam; Dzilno Dmitry A.; Baluja Sanjeev; Silvetti Mario D.

11282724

Substrate processing systems, apparatus, and methods with factory interface environmental contr【我.爱.线.报.网.】ols

Koshti Sushant S.; Hruzek Dean C.; Majumdar Ayan; Menk John C.; Lee Helder T.; Patil Sangram; Rajaram Sanjay; Baumgarten Douglas; Merry Nir

11282745

Methods for filling features with ruthenium

Yu Sang-Ho; Ganguli Seshadri

11282755

Asymmetry correction via oriented wafer loading

Lau Eric; Garretson Char【我.爱.线.报.网.】les C.; Zhang Huanbo; Zhu Zhize

11282936

Horizontal gate all around device nanowire air gap spacer formation

Sun Shiyu; Kim Nam Sung; Wood Bingxi Sun; Yoshida Naomi; Kung Sheng-Chin; Jin Miao

11284018

Smart camera substrate

Ummethala Upendra; Kraus Philip; Berding Keith; Erickson Blake; Tae Patrick; Holey【我.爱.线.报.网.】annavar Devendra Channappa; Nara Shivaraj Manjunath; Parameshwarappa Anandakumar; Nagarajan Sivasankar; Kumar Dhirendra

11284500

Method of controlling ion energy distribution using a pulse generator

Dorf Leonid; Luere Olivier; Dhindsa Rajinder; Rogers James; Srinivasan Sunil; Mishra Anurag Kumar

1128655【我.爱.线.报.网.】6

Selective deposition of titanium films

Yoon Byunghoon; Lei Wei; Yu Sang Ho

11286564

Tin-containing precursors and methods of depositing tin-containing films

Knisley Thomas; Saly Mark; Thompson David

11289310

Circuits for edge ring control in shaped DC pulsed plasma process device

Cui Linying; Rogers James【我.爱.线.报.网.】

11289312

Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability

Allen Adolph M.; Faune Vanessa; Hua Zhong Qiang; Savandaiah Kirankumar Neelasandra; Subramani Anantha K.; Kraus Philip A.; Gung Tza-Jing; Zhou Lei; Chong Halbert; Soni Vaibhav; Kalathiparambil Kishor

11289329

Metho【我.爱.线.报.网.】ds and apparatus for filling a feature disposed in a substrate

Li Rui; Xie Xiangjin; Zhang Fuhong; Pethe Shirish; Allen Adolph; Zhong Lanlan; Tang Xianmin

11289331

Methods for graphene formation using microwave surface-wave plasma on dielectric materials

Zhou Jie; Chen Erica; Liang Qiwei; Ying Chentsau 【我.爱.线.报.网.】Chris; Nemani Srinivas D.; Yieh Ellie Y.

11289342

Damage free metal conductor formation

Ren He; Kim Jong Mun; Clemons Maximillian; Yu Minrui; Naik Mehul; Ying Chentsau

11289347

Non-contact clean module

Rangarajan Jagan; Blank Adrian; Golubovsky Edward; Jaganathan Balasubramaniam Coimbatore; Zuniga Steven 【我.爱.线.报.网.】M.; Mikhaylichenko Ekaterina; Anderson Michael A.; Domin Jonathan P.

11289352

In-situ metrology and process control

Krishnamurthy Ramesh; Karuppiah Lakshmanan

11289357

Methods and apparatus for high voltage electrostatic chuck protection

Wada Yuichi; Ow Yueh Sheng; Jupudi Ananthkrishna; Goh Clinton; Liew 【我.爱.线.报.网.】Kai Liang; Babu Sarath

11289361

Patterned chuck for double-sided processing

Godet Ludovic; Meyer Timmerman Thijssen Rutger

11289369

Low-k dielectric with self-forming barrier layer

Ding Yi; Mukherjee Shaunak; Xie Bo; Yim Kang Sub; Padhi Deenesh

11289374

Nucleation-free gap fill ALD process

Chen Yihong; Chan 【我.爱.线.报.网.】Kelvin; Lu Xinliang; Gandikota Srinivas; Wu Yong; Roy Susmit Singha; Chin Chia Cheng

11289387

Methods and apparatus for backside via reveal processing

Lianto Prayudi; Chi Sik Hin; Hung Shih-Chao; Gan Pin Gian; Vinluan Ricardo Fujii; Mehta Gaurav; Chidambaram Ramesh; See Guan Huei; Sundarrajan Arvind; U【我.爱.线.报.网.】mmethala Upendra V.; Kew Wei Hao; Abdullah Muhammad Adli Danish Bin; Kutney Michael Charles; Wylie Mark McTaggart; Athayde Amulya Ligorio; Mori Glen T.

11289579

P-type dipole for p-FET

Lin Yongjing; Bernal Ramos Karla M; Chen Shih Chung; Yang Yixiong; Dong Lin; Hung Steven C. H.; Gandikota Srinivas

1129【我.爱.线.报.网.】2079

Laser noise elimination in transmission thermometry

Li Jiping; Hunter Aaron Muir; Haw Thomas

11293099

Showerhead assembly with multiple fluid delivery zones

Bansal Amit Kumar; Rocha-Alvarez Juan Carlos; Baluja Sanjeev; Kim Sam H.; Nguyen Tuan Anh

11295786

3D dram structure with high mobility channel

Ka【我.爱.线.报.网.】ng Chang Seok; Kitajima Tomohiko; Lee Gill Yong; Natarajan Sanjay; Kang Sung-Kwan; Liu Lequn

11295938

Multi-radius magnetron for physical vapor deposition (PVD) and methods of use thereof

Song Jiao; Chan Anthony Chih-Tung; Gunther David; Savandaiah Kirankumar Neelasandra; Wysok Irena H.

11296296

Organic 【我.爱.线.报.网.】light-emtting diode light extraction layer having graded index of refraction

Yu Gang; Chen Chung-Chia; Lin Wan-Yu; Bang Hyunsung; Xu Lisong; Kwak Byung Sung; Visser Robert Jan

11298794

Chemical mechanical polishing using time share control

Zhang Jimin; Tang Jianshe; Brown Brian J.; Lu Wei; Diep Priscill【我.爱.线.报.网.】a

11299805

Plasma corrision resistive heater for high temperature processing

Khaja Abdul Aziz; Duan Ren-Guan; Bansal Amit Kumar; Zhou Jianhua; Rocha-Alvarez Juan Carlos

11299806

Gas injection for de-agglomeration in particle coating reactor

Frankel Jonathan; Truong Quoc; Krishnasamy Sekar; Desai Govindraj【我.爱.线.报.网.】; Desai Sandip S.

11300871

Extreme ultraviolet mask absorber materials

Liu Shiyu; Liu Shuwei; Jindal Vibhu; Zerrade Azeddine

11300872

Extreme ultraviolet mask absorber materials

Liu Shuwei; Jindal Vibhu

11302519

Method of patterning a low-k dielectric film

Nemani Srinivas D.; Pender Jeremiah T.; Zhou Qingjun【我.爱.线.报.网.】; Lubomirsky Dmitry; Belostotskiy Sergey G.

11302520

Chamber apparatus for chemical etching of dielectric materials

Tan Tien Fak; Lubomirsky Dmitry; Floyd Kirby H.; Nguyen Son T.; Palagashvili David; Tam Alexander; Chen Shaofeng

11302536

Deflectable platens and associated methods

Yin Ming; Sun Dawei

113025【我.爱.线.报.网.】49

Substrate vacuum transport and storage apparatus

Thirunavukarasu Sriskantharajah; Peh Eng Sheng; Nemani Srinivas D.; Sundarrajan Arvind; Avula Avinash; Yieh Ellie Y.

11302557

Electrostatic clamping system and method

Carroll James

11302699

Methods of forming self-aligned contacts comprising reusing hardm【我.爱.线.报.网.】ask materials and lithography reticles

Teo Russell Chin Yee

11306393

Methods and apparatus for ALD processes

Kho Jeffrey A.; Kao Chien-Teh; Zhou Jianhua

11306394

Iridium precursors for ALD and CVD thin film deposition and uses thereof

Knisley Thomas

11306824

Dual port remote plasma clean isolation valve

Riord【我.爱.线.报.网.】on Benjamin B.; Carlson Charles T.; Webb Aaron; Wyka Gary

11306971

Heat exchanger with multistaged cooling

Gajendra Manoj A.

11309163

Multibeamlet charged particle device and method

Vaez-Iravani Mehdi; Bencher Christopher Dennis; Sreerambhatla Krishna; Fawaz Hussein; Engel Lior; Perlmutter Robert

11309169

B【我.爱.线.报.网.】iasable flux optimizer / collimator for PVD sputter chamber

Riker Martin Lee; Zhang Fuhong; Infante Anthony; Wang Zheng

11309278

Methods for bonding substrates

Lianto Prayudi; See Guan Huei; Thirunavukarasu Sriskantharajah; Sundarrajan Arvind; Dai Xundong; Fung Peter Khai Mum

11309404

Integrated CMOS sour【我.爱.线.报.网.】ce drain formation with advanced control

Colombeau Benjamin; Mandrekar Tushar; Liu Patricia M.; Parikh Suketu Arun; Bauer Matthias; Kioussis Dimitri R.; Natarajan Sanjay; Dube Abhishek

11311491

Metal oxide encapsulated drug compositions and methods of preparing the same

Neikirk Colin C.; Frankel Jonatha【我.爱.线.报.网.】n

11313034

Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor deposition

Zeng Weimin; Cao Yong; Diehl Daniel Lee; Dai Huixiong; Phan Khoi; Ngai Christopher; Wang Rongjun; Tang Xianmin

11313404

Spring-loaded fastening system for process chamber liners

Webb Benja【我.爱.线.报.网.】min F.

11314232

Frequency response diagnostics for characterizing servo controlled mechanisms

Cranmer Adam Christopher

11315232

Residue detection using a luminance histogram

Benvegnu Dominic J.; Motamedi Nojan

11315760

Symmetric plasma process chamber

Carducci James D.; Tavassoli Hamid; Balakrishna Ajit; Che【我.爱.线.报.网.】n Zhigang; Nguyen Andrew; Buchberger, Jr. Douglas A.; Ramaswamy Kartik; Rauf Shahid; Collins Kenneth S.

11315763

Shaped electrodes for improved plasma exposure from vertical plasma source

Bera Kallol; Dzilno Dmitry A.; Subramani Anantha K.; Forster John C.; Tanaka Tsutomu

11315769

Plasma source for rotat【我.爱.线.报.网.】ing susceptor

Bera Kallol; Subramani Anantha K.; Forster John C.; Kraus Philip A.; Houshmand Farzad; Chen Hanhong

11315771

Methods and apparatus for processing a substrate

Xie Xiangjin; Zhang Fuhong; Pethe Shirish A.; Riker Martin Lee; Lo Lewis Yuan Tse; Zhong Lanlan; Tang Xianmin; Connors Paul Dennis

11【我.爱.线.报.网.】315787

Multiple spacer patterning schemes

Yang Tzu-shun; Cheng Rui; Janakiraman Karthik; Huang Zubin; Kedlaya Diwakar; Gupta Meenakshi; Guggilla Srinivas; Lin Yung-chen; Oshio Hidetaka; Li Chao; Lee Gene

11315790

Enhanced substrate amorphization using intermittent ion exposure

Charnvanichborikarn Supakit【我.爱.线.报.网.】; Hatem Christopher R.

11315806

Batch heating and cooling chamber or loadlock

Schaller Jason M.; Vopat Robert Brent; Pergande Paul E.; Riordon Benjamin B.; Blahnik David; Weaver William T.

11315819

System apparatus and method for enhancing electrical clamping of substrates using photo-illumination

Chen Qi【我.爱.线.报.网.】n; Blake Julian G.; Osborne Michael W.; Anella Steven M.; Fischer Jonathan D.

11315890

Methods of forming microvias with reduced diameter

Buch Chintan; Gouk Roman; Verhaverbeke Steven

11315943

Bottom-up approach to high aspect ratio hole formation in 3D memory structures

Gopalraja Praburam; Roy Susmit Sin【我.爱.线.报.网.】gha; Mallick Abhijit Basu; Gandikota Srinivas

11321839

Interactive training of a machine learning model for tissue segmentation

Jha Sumit Kumar; Sista Aditya; Raghunathan Ganesh Kumar Mohanur; Kumar Ubhay; Sapre Kedar

11322337

Plasma processing system workpiece carrier with thermally isolated heater plat【我.爱.线.报.网.】e blocks

Lubomirsky Dmitry; Nguyen Son T.; Nguyen Anh N.; Palagashvili David

11322347

Conformal oxidation processes for 3D NAND

Swenberg Johanes F.; Kim Taewan; Olsen Christopher S.; Hansen Erika

11322352

Nitrogen-doped carbon hardmask films

Min Xiaoquan; Xu Lu; Kulshreshtha Prashant Kumar; Lee Kwangduk Do【我.爱.线.报.网.】uglas

11322381

Method for substrate registration and anchoring in inkjet printing

Zhang Daihua; Ng Hou T.; Patibandla Nag B.; Ganapathiappan Sivapackia; Luo Yingdong; Cho Kyuil; Chen Han-Wen

11322649

Three color light sources integrated on a single wafer

Chudzik Michael; Sanchez Errol Antonio C.

11322685

Co【我.爱.线.报.网.】ntrolling positive feedback in filamentary RRAM structures

Pe{hacek over (s)}ić Milan; Larcher Luca; Beltrando Bastien

11325223

Carrier head with segmented substrate chuck

Zuniga Steven M.; Gurusamy Jay

11325827

Pore formation in a substrate

Kraus Philip Allan; Johnson Joseph R.

11326253

Atomic layer deposit【我.爱.线.报.网.】ion of protective coatings for semiconductor process chamber components

Fenwick David; Sun Jennifer Y.

11326256

Dome stress isolating layer

Bonecutter Luke; Yang Yunzhe; Choudhury Rupankar; Kangude Abhijit

11327218

Method of direct etching fabrication of waveguide combiners

Young Michael Yu-tak; McMillan W【我.爱.线.报.网.】ayne; Meyer Timmerman Thijssen Rutger; Visser Robert Jan

11328900

Plasma ignition circuit

Pratt Teryl; Wang Rongping; Mao Guomin; Chuang Andy

11328909

Chamber conditioning and removal processes

Zhang Hanshen; Cui Zhenjiang; Ingle Nitin

11328928

Conformal high concentration boron doping of semiconductors

Gand【我.爱.线.报.网.】ikota Srinivas; Mallick Abhijit Basu; Srinivasan Swaminathan; Cheng Rui; Roy Susmit Singha; Thareja Gaurav; Srinivasan Mukund; Natarajan Sanjay

11328929

Methods, apparatuses and systems for substrate processing for lowering contact resistance

Ow Yueh Sheng; Wei Junqi; Shoo Wen Long Favier; Jupudi Anant【我.爱.线.报.网.】hkrishna; Shimizu Takashi; Boh Kelvin; Koh Tuck Foong

11328938

Substrate processing apparatus and methods with factory interface chamber filter purge

Rice Michael R.

11328943

Dual gate and single actuator system

Kuppannan Kumaresan; Amir Ofer; Kuchar Michael

11328964

Prescriptive analytics in highly colline【我.爱.线.报.网.】ar response space

Bhatia Sidharth; Feng Jie; Cantwell Dermot

11329003

Anchoring dies using 3D printing to form reconstructed wafer

Zhang Daihua; Ng Hou T.; Patibandla Nag B.; Ganapathiappan Sivapackia; Luo Yingdong; Cho Kyuil; Chen Han-Wen

11329052

Method of processing DRAM

Liu Lequn; Panda Priyadarshi; Sh【我.爱.线.报.网.】aw Jonathan C.

11330673

Heated substrate support

Raj Govinda

11331855

Additive manufacturing with dithering scan path

Yao Zhengping; Steffas Paul J.

11332376

Diamond-like carbon film

Venkatasubramanian Eswaranand; Gottheim Samuel E.; Manna Pramit; Mallick Abhijit Basu

11332488

Metal precursors with modified di【我.爱.线.报.网.】azabutadiene ligands for CVD and ALD and methods of use

Anthis Jeffrey W.; Basu Atashi; Thompson David; Kazem Nasrin

11332827

Gas distribution plate with high aspect ratio holes and a high hole density

Agarwal Sumit; Baluja Sanjeev; Peterson Chad; Rice Michael R.

11332828

Gas distribution assembly mountin【我.爱.线.报.网.】g for fragile plates to prevent breakage

Griffin Kevin; Sun Guangwei

11333246

Chamber body design architecture for next generation advanced plasma technology

Nguyen Andrew; Howard Bradley J.; Bright Nicolas J.

11333896

Fabrication of diffraction gratings

Godet Ludovic; McMillan Wayne; Meyer Timmerman Thijs【我.爱.线.报.网.】sen Rutger

11335495

System to optimize voltage distribution along high voltage resistor string in ICT high voltage power supply

Mogaveera Vasu; Lubicki Piotr R.

11335531

Shadow mask apparatus and methods for variable etch depths

Olson Joseph C.; Evans Morgan; Soldi Thomas; Meyer Timmerman Thijssen Rutger;【我.爱.线.报.网.】 Peploski Maurice Emerson

11335543

RF return path for reduction of parasitic plasma

Subramani Anantha K.; Kotrappa Arun Kumar; Kumar Hanish Panavalappil Kumarankutty; Sundar Ramcharan

11335555

Methods for conformal doping of three dimensional structures

Cheng Rui; Yang Yi; Janakiraman Karthik

11335565

Syste【我.爱.线.报.网.】ms and methods to form airgaps

Chen Zhijun; Xu Lin; Wang Anchuan

11335577

Methods and apparatus to prevent interference between processing chambers

Zhang Fuhong; Garg Sunil Kumar; Kiely Paul; Riker Martin Lee; Fruchterman William; Wang Zheng; Wang Xiaodong

11335590

Methods for forming elongated contact ho【我.爱.线.报.网.】le ends

Gilchrist Glen F. R.; Liang Shurong

11335591

Thermal process chamber lid with backside pumping

Cui Anqing; Wu Dien-Yeh; Tang Wei V.; Yang Yixiong; Wang Bo

11335690

Multicolor approach to DRAM STI active cut patterning

Singh Tejinder; Koshizawa Takehito; Mallick Abhijit Basu; Manna Pramit; Fung Nanc【我.爱.线.报.网.】y; Venkatasubramanian Eswaranand; Hwang Ho-yung David; Gottheim Samuel E.

11337277

Circular lamp arrays

Ranish Joseph M.

11338409

Three-zone carrier head and flexible membrane

Oh Jeonghoon; Leighton Jamie

11339466

Heated shield for physical vapor deposition chamber

Lavitsky Ilya; Miller Keith A; Yoshidome Go【我.爱.线.报.网.】ichi

11339469

Vacuum processing system with holding arrangement

Lau Simon

11339475

Film stack overlay improvement

Han Xinhai; Padhi Deenesh; Benjamin Raj Daemian Raj; Enslow Kristopher; Wang Wenjiao; Ogata Masaki; Addepalli Sai Susmita; Jorapur Nikhil Sudhindrarao; Chichkanoff Gregory Eugene; Srivastava S【我.爱.线.报.网.】hailendra; Baek Jonghoon; Ibrahimi Zakaria; Rocha-Alvarez Juan Carlos; Gung Tza-Jing

11342209

Methods and apparatus for measuring edge ring temperature

Hu Ji-Dih; Aderhold Wolfgang R.; Iu Dongming

11342210

Method and apparatus for measuring wafer movement and placement using vibration data

Potter Charles 【我.爱.线.报.网.】G.; Neal Terrance Allen

11342226

Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process

Balakrishnan Karthik; Park Jungrae; Thirunavukarasu Sriskantharajah; Peh Eng Sheng

11342256

Method of fine redistribution interconnect formation for advanced p【我.爱.线.报.网.】ackaging applications

Chen Han-Wen; Verhaverbeke Steven; Cho Kyuil; Lianto Prayudi; See Guan Huei; Dicaprio Vincent

11342481

Preclean and encapsulation of microLED features

Knisley Thomas; Bhuyan Bhaskar Jyoti; Saly Mark; Zhu Mingwei

11343884

Method and apparatus for microwave treatment of dielectric film【我.爱.线.报.网.】s

Ahmad Iftikhar

11344991

Retainer for chemical mechanical polishing carrier head

Nagengast Andrew J.; Zuniga Steven M.

11346875

Micro resonator array sensor for detecting wafer processing parameters

Lin Chuang-Chia; Ummethala Upendra

11348769

Plasma-enhanced anneal chamber for wafer outgassing

Hawrylchak Lar【我.爱.线.报.网.】a; Scotney-Castle Matthew D.; Tam Norman L.; Spuller Matthew; Chan Kong Lung Samuel; Iu Dongming; Moffatt Stephen

11348783

Methods and apparatus for dynamical control of radial uniformity with two-story microwave cavities

Kobayashi Satoru; Sugai Hideo; Ivanov Denis; Scudder Lance; Lubomirsky Dmitry

1134【我.爱.线.报.网.】8803

Formation of bottom isolation

Lee Byeong Chan

11348813

Correcting component failures in ion implant semiconductor manufacturing tool

Liao Tianqing; Didari Sima; Rajagopal Harikrishnan

11348823

Compliant robot blade for substrate support and transfer

Sansoni Steven V.; Brodine Jeffrey; Mori Glen

11348846【我.爱.线.报.网.】

Wafer processing tool having a micro sensor

Tedeschi Leonard

11348983

Conductive oxide overhang structures for OLED devices

Choung Ji-Young; Chen Chung-Chia; Lin Yu Hsin; Lee Jungmin; Haas Dieter; Kim Si Kyoung

11352711

Fluid recovery in semiconductor processing

Lee Sam; Hanson Kyle M.; Bergman Eric J.

1135【我.爱.线.报.网.】3381

Portable disc to measure chemical gas contaminants within semiconductor equipment and clean room

Holeyannavar Devendra Channappa; Hruzek Dean C.; Ramachandraiah Arunkumar; Hudgens Jeffrey C.; Nara Shivaraj Manjunath; Reuter Paul B.

11353389

Method and apparatus for detection of particle size in a f【我.爱.线.报.网.】luid

Vaez-Iravani Mehdi; Ghosh Avishek

11354383

Successive bit-ordered binary-weighted multiplier-accumulator

Guo Frank Tzen-Wen; Yen She-Hwa

11355317

Methods and apparatus for dynamical control of radial uniformity in microwave chambers

Kobayashi Satoru; Scudder Lance; Britz David; Park Soonam; Lubomirsky【我.爱.线.报.网.】 Dmitry; Sugai Hideo

11355321

Plasma reactor with electrode assembly for moving substrate

Collins Kenneth S.; Rice Michael R.; Ramaswamy Kartik; Carducci James D.

11355325

Methods and systems for monitoring input power for process control in semiconductor process systems

Gopalan Ramesh; Mungekar Hemant; M【我.爱.线.报.网.】ao Guomin; Wang Rongping; Pratt Teryl

11355354

Thermal deposition of doped silicon oxide

Shen Zeqing; Qi Bo; Mallick Abhijit Basu; Ingle Nitin K.

11355358

Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications

See Guan Huei; Lianto Prayudi; Gu Yu

11355367

Robot for simultan【我.爱.线.报.网.】eous substrate transfer

Schaller Jason M.; Carlson Charles T.; Bonecutter Luke; Blahnik David; Muthukamatchi Karuppasamy; Hudgens Jeff; Riordon Benjamin

11355368

Decentralized substrate handling and processing system

Lloyd Scott Gregory

11355391

Method for forming a metal gapfill

Cen Xi; Ma Feiyue; Wu Kai;【我.爱.线.报.网.】 Lei Yu; Daito Kazuya; Xu Yi; Banthia Vikash; Chang Mei; Ren He; Hung Raymond Hoiman; Yao Yakuan; Gelatos Avgerinos V.; Or David T.; Zhou Jing; Jian Guoqiang; Lin Chi-Chou; Lai Yiming; Ye Jia; Wang Jenn-Yue

11355394

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate br【我.爱.线.报.网.】eakthrough treatment

Lei Wei-Sheng; Eaton Brad; Kumar Ajay

11355724

Organic light-emitting diode (OLED) display devices with UV-cured filler

Yu Gang; Chen Chung-Chia; Lin Wan-Yu; Bang Hyunsung; Xu Lisong; Kwak Byung Sung; Visser Robert Jan

11358809

Vacuum robot apparatus for variable pitch access

Thanu Raj【我.爱.线.报.网.】kumar; Hudgens Jeffrey C.; Muthukamatchi Karuppasamy

11359281

Selective deposition of SiCON by plasma ALD

Zhang Shuaidi; Li Ning; Balseanu Mihaela

11359282

Methods for forming impurity free metal alloy films

Bajaj Geetika; Thakare Darshan; Goradia Prerna; Visser Robert Jan; Yang Yixiong; Wrench Jacqueline【我.爱.线.报.网.】 S.; Gandikota Srinivas

11359286

Quartz crystal microbalance concentration monitor

Winkler Jereld; Verghese Mohith

11359722

Multinode multi-use O-ring and method for forming a seal

Maheshwari Shagun P.; Yang Yao-Hung; Lee King F.; Yu Andrew; Pal Aniruddha; Cho Tom K.; Liao Chien-Min

11359732

Method and mech【我.爱.线.报.网.】anism for symmetrically controlling pressure in process chamber

Santi David

11359972

Temperature calibration with band gap absorption method

Cong Zhepeng; Chu Schubert S.; Myo Nyi O.

11360298

Reflective display devices and components

Nordsell Robert Anthony; Chadha Arvinder M.

11361935

Apparatus and system i【我.爱.线.报.网.】ncluding high angle extraction optics

Biloiu Costel; Wallace Jay R.; Daniels Kevin M.; Sinclair Frank; Campbell Christopher

11361939

Semiconductor processing chamber for multiple precursor flow

Samir Mehmet Tugrul; Yang Dongqing; Lubomirsky Dmitry; Hillman Peter; Park Soonam; Choy Martin Yue; Zhu Lala

11【我.爱.线.报.网.】361940

Push-pull power supply for multi-mesh processing chambers

Hammond Edward P.

11361941

Methods and apparatus for processing a substrate

Kim Junghoon; Cho Tae Seung; Lubomirsky Dmitry; Tran Toan

11361948

Temperature measurement for substrate carrier using a heater element array

Criminale Phillip; Guo Zh【我.爱.线.报.网.】iqiang

11361950

Multi-cathode processing chamber with dual rotatable shields

Mazzocco John Joseph; Lafollett Cory Eugene

11361968

Atomic layer deposition using a substrate scanning system

Gilchrist Glen F R

11361978

Gas delivery module

Khan Adib M.; Liang Qiwei; Malik Sultan; Nemani Srinivas D.

11361981

Batch 【我.爱.线.报.网.】substrate support with warped substrate capability

Patel Shashidhara; Jupudi Ananthkrishna; Gautam Ribhu

11361982

Methods and apparatus for in-situ cleaning of electrostatic chucks

Savandaiah Kirankumar Neelasandra; Johanson William R.; Gunther David; Prabhu Prashant Prabhakar

11361991

Method for Si gap f【我.爱.线.报.网.】ill by PECVD

Liu Xin; Wang Fei; Cheng Rui; Mallick Abhijit Basu; Visser Robert Jan

11362235

Substrate structuring methods

Chen Han-Wen; Verhaverbeke Steven; Park Giback

11362275

Annealing processes for memory devices

Breil Nicolas Louis Gabriel; Krishnan Siddarth; Sharma Shashank; Someshwar Ria; Ng Kai; Ka【我.爱.线.报.网.】malanathan Deepak

11362307

Encapsulation having polymer and dielectric layers for electronic displays

Cho Kyuil; Kwak Byung Sung; Visser Robert Jan

11362404

Microwave window including first and second plates with vertical stepped areas configured for pressure sealing a dielectric plate between the first 【我.爱.线.报.网.】and second plates

Putti Rajesh Kumar; Agarwal Prashant; Jupudi Ananthkrishna

11363172

Camera enclosure for thermal management

Leshniak Itai

11365476

Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices

Jha Praket P.; Ko Allen; Han Xinhai; Kwon 【我.爱.线.报.网.】Thomas Jongwan; Kim Bok Hoen; Kil Byung Ho; Kim Ryeun; Kim Sang Hyuk

11367589

Modulation of ion beam angle

Olson Joseph C.; Evans Morgan; Meyer Timmerman Thijssen Rutger

11367593

Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device

Cui Linying; Rogers James【我.爱.线.报.网.】

11367594

Multizone flow gasbox for processing chamber

Tong Mingle; Xia Li-Qun; Raj Daemian Raj Benjamin

11367614

Surface roughness for flowable CVD film

Guo Jinrui; Liang Jingmei; Jha Praket P.; Zhang Li

11367643

Method for substrate registration and anchoring in inkjet printing

Zhang Daihua; Ng Hou T.; Pat【我.爱.线.报.网.】ibandla Nag B.; Ganapathiappan Sivapackia; Luo Yingdong; Cho Kyuil; Chen Han-Wen

11367645

Temperature tunable multi-zone electrostatic chuck

Criminale Phillip; Guo Zhiqiang; Myles Andrew

11367653

Systems and methods for improving within die co-planarity uniformity

McHugh Paul; Roh Kwan Wook; Wilson Gregor【我.爱.线.报.网.】y J.

11368003

Seamless electrical conduit

Kraus Philip Allan; Subramani Anantha K.

11370078

Chamber components with polished internal apertures

Sun Jennifer Y.; Firouzdor Vahid; Koonce David; Kanungo Biraja Prasad

11370079

Reinforcement ring for carrier head with flexible membrane

Oh Jeonghoon; Leighton Jami【我.爱.线.报.网.】e

11370083

Pad conditioner cleaning system

Gadgil Shantanu Rajiv; Patankar Sumit Subhash; Davis Nathan Arron; Coughlin Michael J.; DAmbra Allen L.

11370114

Autoteach enclosure system

Kopec Nicholas Michael; Kosinski Lyle; Farber Matvey; Hudgens Jeffrey

11370669

Amorphous silicon doped yttrium oxide films an【我.爱.线.报.网.】d methods of formation

Sato Tatsuya E.; Xia Li-Qun; Seutter Sean M.

11371136

Methods for selective deposition of dielectric on silicon oxide

Bhuyan Bhaskar Jyoti; Saly Mark; Thompson David; Kalutarage Lakmal C.; Howlader Rana

11371144

Low-k films

Zhang Shuaidi; Li Ning; Balseanu Mihaela

11371148

Fabricating 【我.爱.线.报.网.】a recursive flow gas distribution stack using multiple layers

Agarwal Sumit; Subramani Anantha K; Guo Yang; Chandrasekar Siva

11371159

Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Bergman Eric J; Crane Stuart; Youngbull Tricia A; Stolt Timothy 【我.爱.线.报.网.】G

11372149

Depth-modulated slanted gratings using gray-tone lithography and slant etch

Meyer Timmerman Thijssen Rutger; Godet Ludovic

11373803

Method of forming a magnetic core on a substrate

Suo Peng; Gu Yu; See Guan Huei; Sundarrajan Arvind

11373845

Methods and apparatus for symmetrical hollow cathode ele【我.爱.线.报.网.】ctrode and discharge mode for remote plasma processes

Cho Tae Seung; Natarajan Saravana Kumar; Schatz Kenneth D.; Lubomirsky Dmitry; Subramanya Samartha

11373871

Methods and apparatus for integrated selective monolayer doping

Colombeau Benjamin; Aderhold Wolfgang R.; Lo Andy; Huang Yi-Chiau

11373877

Metho【我.爱.线.报.网.】ds and apparatus for in-situ protection liners for high aspect ratio reactive ion etching

Shimizu Daisuke; Hatakeyama Taiki; Koseki Shinichi; Kang Sean S.; Payyapilly Jairaj Joseph; Watanabe Hikaru

11373882

Coated article and semiconductor chamber apparatus formed from yttrium oxide and zirconium oxide【我.爱.线.报.网.】

Sun Jennifer Y.; Duan Ren-Guan; Yuan Jie; Xu Li; Collins Kenneth S.

11373890

Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing

Gopalan Ramesh

11373891

Front-ducted equipment front end modules, side storage pods, and methods of operating the same

Reute【我.爱.线.报.网.】r Paul B.; Armstrong Robin C.; Menk John C.; Merry Nir

11373893

Cryogenic electrostatic chuck

Sarode Vishwanath Yogananda; Babayan Steven E.; Prouty Stephen Donald; De Gorordo Alvaro Garcia; Schmid Andreas; Noujaim Andrew Antoine

11373903

Doped selective metal caps to improve copper electromigration with【我.爱.线.报.网.】 ruthenium liner

Naik Mehul B.; Wu Zhiyuan

11374165

Method of forming ultra-smooth bottom electrode surface for depositing magnetic tunnel junctions

Xue Lin; Hassan Sajjad Amin; Pakala Mahendra; Ahn Jaesoo

11374170

Methods to form top contact to a magnetic tunnel junction

Xue Lin; Ahn Jaesoo; Tseng Hsin-we【我.爱.线.报.网.】i; Pakala Mahendra

11375584

Methods and apparatus for processing a substrate using microwave energy

Koh Tuck Foong; Ow Yueh Sheng; Chen Nuno Yen-Chu; Jupudi Ananthkrishna; Rao Preetham P.

11376709

Components for a chemical mechanical polishing tool

Attur Sreenidhi

11377310

Magnetic levitation system, base o【我.爱.线.报.网.】f a magnetic levitation system, vacuum system, and method of contactlessly holding and moving a carrier in a vacuum chamber

Aust Henning; Meiss Thorsten

11378426

System and method for monitoring sensor linearity as part of a production process

Schulze Bradley D.; Armacost Michael D.

11378511

Methods and a【我.爱.线.报.网.】pparatus for detecting corrosion of conductive objects

Peng Gang Grant; Mikkola Robert Douglas; Britz David; Scudder Lance; Groechel David W.

11380517

System and method for spatially resolved optical metrology of an ion beam

Shu Gang; Gilchrist Glen; Liang Shurong

11380524

Low resistance confinement liner【我.爱.线.报.网.】 for use in plasma chamber

Perry Joseph

11380536

Multi-step pre-clean for selective metal gap fill

Cen Xi; Yao Yakuan; Lai Yiming; Wu Kai; Gelatos Avgerinos V.; Or David T.; Kashefi Kevin; Lei Yu; Dong Lin; Ren He; Xu Yi; Naik Mehul; Chen Hao; Ling Mang-Mang

11380557

Apparatus and method for gas delivery 【我.爱.线.报.网.】in semiconductor process chambers

Kirchhoff Vincent; Gungor Faruk; Rabinovich Felix; Keppers Gary

11380564

Processing system having a front opening unified pod (FOUP) load lock

Newman Jacob

11380572

Substrate support carrier with improved bond layer protection

Prouty Stephen Donald; Schmid Andreas; Simmons【我.爱.线.报.网.】 Jonathan; Banda Sumanth

11380575

Film thickness uniformity improvement using edge ring and bias electrode geometry

Lo Kin Pong; Nagorny Vladimir; Liu Wei; Guarini Theresa Kramer; Hwang Bernard L.; Bevan Malcolm J.; Abraham Jacob; Behera Swayambhu Prasad

11380578

Formation of angled gratings

Meyer Timmerm【我.爱.线.报.网.】an Thijssen Rutger; Olson Joseph C.; Evans Morgan

11380691

CMOS over array of 3-D DRAM device

Varghese Sony; Fishburn Fred

11380801

Process to reduce plasma induced damage

Li Jianheng; Zhao Lai; Zhai Yujia; Choi Soo Young

11384428

Carbon layer covered mask in 3D applications

Ling Mang-Mang; Kwon Thomas; Kim 【我.爱.线.报.网.】Jong Mun; Ying Chentsau Chris

11384429

Selective cobalt deposition on copper surfaces

Yu Sang-Ho; Moraes Kevin; Ganguli Seshadri; Chung Hua; Phan See-Eng

11384432

Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate

Rasheed Muhammad M.; Gandikota Srinivas; S【我.爱.线.报.网.】anchez Mario Dan; Jian Guoqiang; Yang Yixiong; Jadhav Deepak; Agarwal Ashutosh

11384648

Methods for depositing coatings on aerospace components

Melnik Yuriy; Chatterjee Sukti; Gangakhedkar Kaushal; Frankel Jonathan; Scudder Lance A.; Narwankar Pravin K.; Britz David Alexander; Knisley Thomas; Saly Mark【我.爱.线.报.网.】; Thompson David

11384838

Seal member

Nakagawa Ippei; Yoshida Nobuhiro; Noorbakhsh Hamid

11385536

EUV mask blanks and methods of manufacture

Xiao Wen; Jindal Vibhu

11385628

Scheduling substrate routing and processing

Wang Chongyang

11387071

Multi-source ion beam etch system

Liang Qiwei; Nemani Srinivas D; Yieh 【我.爱.线.报.网.】Ellie; Buchberger Douglas; Ying Chentsau Chris

11387073

In situ angle measurement using channeling

Sinclair Frank; England Jonathan Gerald; Olson Joseph C.

11387122

Method and apparatus for measuring process kit centering

Potter Charles; Mor Eli

11387134

Process kit for a substrate support

Mustafa Muhannad; 【我.爱.线.报.网.】Rasheed Muhammad M.; Lei Yu; Gelatos Avgerinos V.; Banthia Vikash; Calderon Victor H.; Toh Shi Wei; Lee Yung-Hsin; Sen Anindita

11387135

Conductive wafer lift pin o-ring gripper with resistor

Cotlear Roberto Cesar; Willwerth Michael D.

11387338

Methods for forming planar metal-oxide-semiconductor field-e【我.爱.线.报.网.】ffect transistors

Zhang Qintao; Hong Samphy; Zhong Lei; Lee David Jon; Levitov Felix; Caballero Carlos; Chaturvedula Durgaprasad

11388810

System, apparatus and method for multi-frequency resonator operation in linear accelerator

Kurunczi Peter F.; Blahnik David T.; Sinclair Frank

11388822

Methods for impr【我.爱.线.报.网.】oved polymer-copper adhesion

Chakraborty Tapash; Verhaverbeke Steven; Chen Han-Wen; Buch Chintan; Goradia Prerna; Park Giback; Cho Kyuil

11389925

Offset head-spindle for chemical mechanical polishing

Zuniga Steven M.; Gurusamy Jay; Kim Bum Jick; Loi Danielle

11390638

Molybdenum(VI) precursors for depositi【我.爱.线.报.网.】on of molybdenum films

Leoncini Andrea; Mehlmann Paul; Dordevic Nemanja; Huynh Han Vinh; Yong Doreen Wei Ying; Saly Mark; Bhuyan Bhaskar Jyoti; Liu Feng Q.

11390940

System and method to control PVD deposition uniformity

Xiao Wen; Jindal Vibhu; Bhat Sanjay

11390947

Method of forming a fluorinated metal fil【我.爱.线.报.网.】m

Deepak Nitin; Seth Suresh Chand; Goradia Prerna Sonthalia; Bajaj Geetika; Thakare Darshan; Sun Jennifer Y.; Natu Gayatri

11393661

Remote modular high-frequency source

Nguyen Hanh; Chua Thai Cheng; Kraus Philip Allan

11393665

Physical vapor deposition (PVD) chamber with reduced arcing

Du Chao; Cao Yong; G【我.爱.线.报.网.】ong Chen; Li Mingdong; Zhang Fuhong; Wang Rongjun; Tang Xianmin

11393678

Low-k dielectric films

Durand William J.; Saly Mark; Kalutarage Lakmal C.; Yim Kang Sub; Mukherjee Shaunak

11393703

Apparatus and method for controlling a flow process material to a deposition chamber

Lerner Alexander; Shaviv Roey; S【我.爱.线.报.网.】tout Phillip; Ranish Joseph M; Kothnur Prashanth; Radhakrishnan Satish

11393710

Wafer edge ring lifting solution

Rice Michael R.; Sarode Vishwanath Yogananda; Srinivasan Sunil; Dhindsa Rajinder; Babayan Steven E.; Luere Olivier; Koosau Denis M.; Yousif Imad

11393916

Methods for GAA I/O formation by selec【我.爱.线.报.网.】tive epi regrowth

Colombeau Benjamin; Bauer Matthias; Siddiqui Naved Ahmed; Stout Phillip

11396698

ALD process for NiO film with tunable carbon content

Anthis Jeffrey W.; Saheli Ghazal; Liu Feng Q.; Thompson David

11396699

Method for controlling a processing system

Neuber Andreas

11396703

Apparatus and metho【我.爱.线.报.网.】ds for improving chemical utilization rate in deposition process

Griffin Kevin; Baluja Sanjeev; AuBuchon Joseph; Silvetti Mario D.; Ponnekanti Hari

11397289

Controlling etch angles by substrate rotation in angled etch tools

Meyer Timmerman Thijssen Rutger; Evans Morgan; Olson Joseph C.

11397384

Signal rec【我.爱.线.报.网.】ognition during substrate patterning via digital photolithography

Sallak Rashid M.

11398369

Method and apparatus for actively tuning a plasma power source

Wang Rongping; Salimian Siamak; Cho Tom K.

11398388

Methods for selective dry etching gallium oxide

Liu Feng Q.; Enman Lisa J.; Kalutarage Lakmal C.; Sa【我.爱.线.报.网.】ly Mark J.

11398433

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Chen Han-Wen; Verhaverbeke Steven; See Guan Huei; Park Giback; Cellere Giorgio; Tonini Diego; Dicaprio Vincent; Cho Kyuil

11400545

Laser ablation for package fabrication

Leschkies Kurtis; 【我.爱.线.报.网.】Lei Wei-Sheng; Franklin Jeffrey L.; Delmas Jean; Chen Han-Wen; Park Giback; Verhaverbeke Steven

11400560

Retaining ring design

Oh Jeonghoon; Garretson Charles C.; Lau Eric; Nagengast Andrew; Zuniga Steven M.; Suarez Edwin C.; Zhang Huanbo; Brown Brian J.

11400649

Air knife assembly for additive manufactu【我.爱.线.报.网.】ring

Patel Dakshalkumar; Chaturvedi Girish Kumar; Upadhye Bahubali S.; Acharya Sumedh; Chidambaram Mahendran; Bagul Nilesh Chimanrao

11401599

Erosion resistant metal silicate coatings

He Xiao-Ming; Chou Cheng-Hsuan; Sun Jennifer Y.

11401602

Catalyst enhanced seamless ruthenium gap fill

Yoon Byunghoon; Gang【我.爱.线.报.网.】uli Seshadri; Cen Xi

11404248

Modular microwave plasma source

Kraus Philip Allan; Chua Thai Cheng

11404263

Deposition of low-stress carbon-containing layers

Wang Huiyuan; Kustra Rick; Qi Bo; Mallick Abhijit Basu; Alayavalli Kaushik; Pinson Jay D.

11404296

Method and apparatus for measuring placement of a su【我.爱.线.报.网.】bstrate on a heater pedestal

Potter Charles G.; Vaughan Anthony D.

11404297

Systems, apparatus, and methods for an improved load port

Bonecutter Luke W.; Blahnik David T.; Reuter Paul B.

11404313

Selective tungsten deposition at low temperatures

Xu Yi; Hu Yufei; Lei Yu; Daito Kazuya; He Da; Cen Jiajie

11404【我.爱.线.报.网.】314

Metal line patterning

Varghese Sony; Zeeshan M. Arif; Kallakuri Shantanu; Chan Kelvin

11404318

Methods of forming through-silicon vias in substrates for advanced packaging

Suo Peng; Wang Ying W.; See Guan Huei; Yong Chang Bum; Sundarrajan Arvind

11404612

LED device having blue photoluminescent material【我.爱.线.报.网.】 and red/green quantum dots

Luo Yingdong; Xu Lisong; Ganapathiappan Sivapackia; Ng Hou T.; Kwak Byung Sung; Zhu Mingwei; Patibandla Nag B.

11404636

Crested barrier device and synaptic element

Pe{hacek over (s)}ić Milan

11408068

Deposition of tellurium-containing thin films

Knisley Thomas; Woods Keenan N.; 【我.爱.线.报.网.】Saly Mark; Winter Charles H.; Upadhyay Apoorva

11408075

Batch curing chamber with gas distribution and individual pumping

Khan Adib; Venkataraman Shankar; Pinson, II Jay D.; Yang Jang-Gyoo; Ingle Nitin Krishnarao; Liang Qiwei

11408530

Valve for varying flow conductance under vacuum

Mustafa Muhannad; Rashe【我.爱.线.报.网.】ed Muhammad M.

11410860

Process chamber for etching low k and other dielectric films

Lubomirsky Dmitry; Nemani Srinivas; Yieh Ellie; Belostotskiy Sergey G.

11410869

Electrostatic chuck with differentiated ceramics

Parkhe Vijay D.

11410873

Deep trench integration processes and devices

Yu Lan; Sherwood Tyler; 【我.爱.线.报.网.】Chudzik Michael; Krishnan Siddarth

11410881

Impurity removal in doped ALD tantalum nitride

Li Rui; Xie Xiangjin; Ha Tae Hong; Tang Xianmin; Chen Lu

11410885

Fully aligned subtractive processes and electronic devices therefrom

Ren He; Jiang Hao; Naik Mehul

11411039

Stacked pixel structure formed using epitax【我.爱.线.报.网.】y

Chen Papo; Boland John; Chu Schubert S.; Sanchez Errol Antonio C.; Moffatt Stephen

11411125

Ferroelectric-assisted tunneling selector device

Pe{hacek over (s)}ić Milan

11413744

Multi-turn drive assembly and systems and methods of use thereof

Hudgens Jeff; Cox Damon K.; Thanu Rajkumar

11413767

Sensor-based 【我.爱.线.报.网.】position and orientation feedback of robot end effector with respect to destination chamber

Shivanna Preetham Kariyaiah; Hudgens Jeffrey; Wirth Paul Zachary

11413817

Air knife inlet and exhaust for additive manufacturing

Patel Dakshalkumar; Chaturvedi Girish Kumar; Upadhye Bahubali S.; Acharya Sumedh; C【我.爱.线.报.网.】hidambaram Mahendran; Bagul Nilesh Chimanrao

11414740

Processing system for forming layers

Lerner Alexander N.; Shaviv Roey; Karazim Michael P.; Moraes Kevin Vincent; Sansoni Steven V.; Constant Andrew J.; Brodine Jeffrey Allen; Vellore Kim Ramkumar; Sade Amikam; Kumar Niranjan

11414751

Self-aligned stru【我.爱.线.报.网.】ctures from sub-oxides

Gandikota Srinivas; Roy Susmit Singha; Mallick Abhijit Basu

11415147

Pumping liner for improved flow uniformity

Mustafa Muhannad; Rasheed Muhammad M.; Sanchez Mario D.

11415463

Contactless workpiece temperature sensor

Pergande Paul E.

11415538

Capacitive sensor housing for chamber cond【我.爱.线.报.网.】ition monitoring

Pan Yaoling; Tae Patrick John; Tedeschi Leonard; Willwerth Michael D.; McCormick Daniel Thomas

11416977

Self-measurement of semiconductor image using deep learning

Kumar Abhinav; Dixit Tarpan

11417010

Image based metrology of surface deformations

Vaez-Iravani Mehdi; Zhao Guoheng

11417515

Met【我.爱.线.报.网.】hods for depositing blocking layers on metal surfaces

Bhuyan Bhaskar Jyoti; Saly Mark; Kalutarage Lakmal C.; Knisley Thomas

11417517

Treatments to enhance material structures

Gandikota Srinivas; Yang Yixiong; Wrench Jacqueline Samantha; Yang Yong; Hung Steven C. H.

11417534

Selective material removal

Xia M【我.爱.线.报.网.】ing; Yang Dongqing; Hsu Ching-Mei

11417537

Methods of etching metal-containing layers

Mehrotra Akhil; Lee Gene S.; Patil Abhijit; Jiang Shan; Hesabi Zohreh

11417553

Substrate deformation detection and correction

Gadre Milind

11417561

Edge ring for a substrate processing chamber

Raj Govinda; Narendrnath Kadth【我.爱.线.报.网.】ala Ramaya; Vasantha Bopanna Ichettira; Yavelberg Simon

11417568

Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill

Lei Wei; Xu Yi; Lei Yu; Ha Tae Hong; Hung Raymond; Pethe Shirish A.

11417605

Reconstituted substrate for radio frequency applications

See Guan Huei; C【我.爱.线.报.网.】hidambaram Ramesh

11420217

Showerhead for ALD precursor delivery

Mustafa Muhannad; Rasheed Muhammad M.

11421316

Methods and apparatus for controlling warpage in wafer level packaging processes

Lianto Prayudi; Rafi Mohamed; Sulaiman Muhammad Azim Bin Syed; See Guan Huei; Kristy Ang Yu Xin; Elumalai Karthik【我.爱.线.报.网.】; Thirunavukarasu Sriskantharajah; Sundarrajan Arvind

11421318

Methods and apparatus for high reflectivity aluminum layers

Wrench Jacqueline; Wu Liqi; Wu Hsiang Ning; Ma Paul; Yu Sang-Ho; Vasiknanonte Fuqun Grace; Sasaki Nobuyuki

11421322

Blocker plate for use in a substrate process chamber

Yuan Xiaoxiong【我.爱.线.报.网.】; Lei Yu; Xu Yi; Daito Kazuya; Lei Pingyan; Wu Dien-Yeh; Kelkar Umesh M.; Banthia Vikash

11421324

Hardmasks and processes for forming hardmasks by plasma-enhanced chemical vapor deposition

Hsu Jui-Yuan; Nittala Krishna; Manna Pramit; Janakiraman Karthik

11421977

Eliminating internal reflections in an int【我.爱.线.报.网.】erferometric endpoint detection system

Lian Lei; Han Pengyu

11422096

Surface topography measurement apparatus and method

Li Weimin; Xiao Wen; Jindal Vibhu; Bhat Sanjay

11424096

Temperature controlled secondary electrode for ion control at substrate edge

Noorbakhsh Hamid; Ramaswamy Kartik; Husain Anwar

11424【我.爱.线.报.网.】097

Ion source with tubular cathode

Koo Bon-Woong; Radovanov Svetlana; Sinclair Frank; Li You Chia; Ewing Peter; Sarajlic Ajdin; Rowland Christopher A.; Carbone Nunzio

11424104

Plasma reactor with electrode filaments extending from ceiling

Collins Kenneth S.; Rice Michael R.; Ramaswamy Kartik; Carducci J【我.爱.线.报.网.】ames D.

11424125

Angled ion implant to reduce MOSFET trench sidewall roughness

Zhang Qintao; Zou Wei; Gossmann Hans-Joachim L.

11424132

Methods and apparatus for controlling contact resistance in cobalt-titanium structures

Kuratomi Takashi; Gelatos Avgerinos; Ha Tae Hong; Lu Xuesong; Ho Szuheng; Lei Wei; 【我.爱.线.报.网.】Lee Mark; Hung Raymond; Tang Xianmin

11424134

Atomic layer etching of metals

Deepak Nitin; Goradia Prerna Sonthalia

11424136

Rare-earth oxide based coatings based on ion assisted deposition

Sun Jennifer Y.; Kanungo Biraja P.; Firouzdor Vahid; Zhang Ying

11424137

Drying process for high aspect ratio features【我.爱.线.报.网.】

Gouk Roman; Chen Han-Wen; Verhaverbeke Steven; Delmas Jean

11424149

Substrate transfer mechanism to reduce back-side substrate contact

Ishii Masato; Collins Richard O.; Giljum Richard; Berger Alexander

11424164

Enhanced etch resistance for insulator layers implanted with low energy ions

Waite Andrew Micha【我.爱.线.报.网.】el; van Meer Johannes M.; Lee Jae Young

11424454

Protection interfaces for Li-ion battery anodes

Rangasamy Ezhiylmurugan; Herle Subramanya P.

11427912

High temperature rotation module for a processing chamber

Mustafa Muhannad; Rasheed Muhammad M.

11427928

Lower side wall for epitaxtail growth apparatus

Okabe【我.爱.线.报.网.】 Akira; Mori Yoshinobu

11429026

Lithography process window enhancement for photoresist patterning

Dai Huixiong; Bangar Mangesh Ashok; Nemani Srinivas D.; Ngai Christopher S.; Yieh Ellie Y.

11430634

Methods of optical device fabrication using an electron beam apparatus

Godet Ludovic; Meyer Timmerman Thijss【我.爱.线.报.网.】en Rutger; Ramaswamy Kartik; Yang Yang; Thothadri Manivannan; Chen Chien-An

11430641

Processing systems and methods to control process drift

Chua Vivien; Kulshreshtha Prashant Kumar; Jiang Zhijun; Ruan Fang; Kedlaya Diwakar

11430654

Initiation modulation for plasma deposition

Mutyala Madhu Santosh Kumar; 【我.爱.线.报.网.】Kamath Sanjay; Padhi Deenesh

11430655

Low temperature high-quality dielectric films

Venkatasubramanian Eswaranand; Gottheim Samuel E.; Manna Pramit; Mallick Abhijit Basu

11430661

Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor deposition

Kuratomi Ta【我.爱.线.报.网.】kashi; Chen I-Cheng; Gelatos Avgerinos V.; Lei Pingyan; Chang Mei; Tang Xianmin

11430672

Drying environments for reducing substrate defects

Velazquez Edwin; Atkinson Jim Kellogg

11430680

Position and temperature monitoring of ALD platen susceptor

Ravid Abraham; Griffin Kevin; Yudovsky Joseph; Gangakhedkar【我.爱.线.报.网.】 Kaushal; Dzilno Dmitry A.; Minkovich Alex

11430686

Pedestal heater for spatial multi-wafer processing tool

Ulavi Tejas; Baluja Sanjeev; Kashyap Dhritiman Subha

11430801

Methods and apparatus for three dimensional NAND structure fabrication

Koshizawa Takehito; Srinivasan Mukund; Kitajima Tomohiko; Kang Ch【我.爱.线.报.网.】ang Seok; Kang Sung-Kwan; Lee Gill Y.; Singha Roy Susmit

11430877

Ion implantation to reduce nanosheet gate length variation

Gu Sipeng; Guo Baonian; Zhang Qintao; Zou Wei; Shim Kyuha

11430898

Oxygen vacancy of amorphous indium gallium zinc oxide passivation by silicon ion treatment

Del-Agua-Borniquel Jose【我.爱.线.报.网.】-Ignacio; Dekkers Hendrik F. W.; Van Meer Hans; Lee Jae Young

11433436

Carousel for ultrasonic cleaning and method of using thereof

Coughlin Michael J.; DAmbra Allen L.

11434254

Dinuclear molybdenum precursors for deposition of molybdenum-containing films

Leoncini Andrea; Mehlmann Paul; Dordevic Nemanja; 【我.爱.线.报.网.】Huynh Han Vinh; Yong Doreen Wei Ying

11434568

Heated ceramic faceplate

Rocha-Alvarez Juan Carlos; Quach David H.

11434569

Ground path systems for providing a shorter and symmetrical ground path

Nguyen Tuan Anh; Schaller Jason M.; Hammond, IV Edward P.; Blahnik David; Ulavi Tejas; Bansal Amit Kumar; Baluja【我.爱.线.报.网.】 Sanjeev; Ma Jun; Rocha Juan Carlos

11437215

Electrostatic filter providing reduced particle generation

Likhanskii Alexandre; Cucchetti Antonella; Hermanson Eric D.; Sinclair Frank; Scheuer Jay T.; Lindberg Robert C.

11437230

Amorphous carbon multilayer coating with directional protection

Wu Wei; Zhang Fe【我.爱.线.报.网.】ng; Yang Xiawan; Choi Jinhan; Khan Anisul Haque

11437238

Patterning scheme to improve EUV resist and hard mask selectivity

Fung Nancy; Lang Chi-I; Hwang Ho-yung David

11437242

Selective removal of silicon-containing materials

Ko Jungmin; Kim Kwang-Soo; Choi Thomas; Ingle Nitin

11437254

Sequencer time leapin【我.爱.线.报.网.】g execution

Wang Chongyang

11437261

Cryogenic electrostatic chuck

Sarode Vishwanath Yogananda; Babayan Steven E.; Prouty Stephen Donald; García De Gorordo Álvaro; Schmid Andreas; Noujaim Andrew Antoine

11437262

Wafer de-chucking detection and arcing prevention

Balasubramanian Ganesh; Yoon Byung Chul; Munge【我.爱.线.报.网.】kar Hemant

11437271

Seamless gap fill

Yang Yixiong; Gandikota Srinivas; Liu Wei

11437284

Contact over active gate structure

Wang Wenhui; Dai Huixiong; Ngai Christopher S.

11437488

Split-gate MOSFET with gate shield

Zhang Qintao; Hong Samphy; Lee David J.; Appell Jason

11437559

Method and apparatus for depositi【我.爱.线.报.网.】on of multilayer device with superconductive film

Zhu Mingwei; Yang Zihao; Patibandla Nag B.; Godet Ludovic; Cao Yong; Diehl Daniel Lee; Chen Zhebo

11440159

Edge load ring

Pai Uday; Oh Jeonghoon; Nguyen Van H.

11441236

Chamber components for epitaxial growth apparatus

Oki Shinichi; Mori Yoshinobu

11441974

De【我.爱.线.报.网.】tection of surface particles on chamber components with carbon dioxide

Wang Changgong; Zuo Zhili; Ke Chang; Suh Song-Moon

11441992

Method and apparatus for detection of particle size in a fluid

Vaez-Iravani Mehdi; Egan Todd; Zhao Guoheng

11442000

In-situ, real-time detection of particulate defects in a fl【我.爱.线.报.网.】uid

Vaez-Iravani Mehdi; Bhoyar Sankesha; Sharma Rachit; Zhao Guoheng

11443919

Film formation via pulsed RF plasma

Nittala Krishna; Kedlaya Diwakar N.; Janakiraman Karthik; Yang Yi; Cheng Rui

11443921

Radio frequency ground system and method

Fu Gaosheng; Nguyen Tuan Anh; Bansal Amit Kumar

11443936

Methods and【我.爱.线.报.网.】 apparatus for aluminum oxide surface recovery

Leal Cervantes Carmen; Jansen Alexander; Xie Xiangjin

11443948

Doping techniques

Aderhold Wolfgang; Huang Yi-Chiau; Liu Wei; Colombeau Benjamin; Mayur Abhilash

11443973

Robot for simultaneous substrate transfer

Schaller Jason M.; Bonecutter Luke; Carlson Charl【我.爱.线.报.网.】es T.; Thanu Rajkumar; Muthukamatchi Karuppasamy; Hudgens Jeff; Riordon Benjamin

11444153

Method of forming stress memorization layer on backside of semiconductor substrate and semiconductor device thereof

Zhang Qintao; Zou Wei

11446711

Steam treatment stations for chemical mechanical polishing system

Wu 【我.爱.线.报.网.】Haosheng; Tang Jianshe; Soundararajan Hari; Chang Shou-Sung; Chen Hui; Chou Chih Chung; Fisher Alexander John; Butterfield Paul D.

11446740

Multiple sequential linear powder dispensers for additive manufacturing

Rowland Christopher A.; Subramani Anantha K.; Krishnan Kasiraman; Ramaswamy Kartik; Brezocz【我.爱.线.报.网.】ky Thomas B.; Srinivasan Swaminathan; Sun Jennifer Y.; Yavelberg Simon; Nemani Srinivas D.; Patibandla Nag B.; Ng Hou T.

11446783

Filtering during in-situ monitoring of polishing

Dhandapani Sivakumar

11446788

Precursor formulations for polishing pads produced by an additive manufacturing process

Bajaj Raj【我.爱.线.报.网.】eev; Redfield Daniel; Orilall Mahendra C.; Fu Boyi; Chockalingam Ashwin; Kumar Ashavani; Redeker Fred C.; Patibandla Nag B.

11447857

Methods and apparatus for reducing tungsten resistivity

Hou Wenting; Lei Jianxin; Ramalingam Jothilingam; Kothnur Prashanth; Johanson William R.

11447865

Deposition of low-【我.爱.线.报.网.】κ films

Zhang Shuaidi; Li Ning; Balseanu Mihaela A.; Bhuyan Bhaskar Jyoti; Saly Mark; Knisley Thomas

11447866

High temperature chemical vapor deposition lid

Mustafa Muhannad; Rasheed Muhammad M.; Sanchez Mario D.; Gandikota Srinivas; Tang Wei V.

11447868

Method for controlling a plasma process

Nguyen Andre【我.爱.线.报.网.】w; Ramaswamy Kartik; Chafin Michael G.; Yang Yang; Rayaroth Anilkumar; Liu Lu

11448977

Gas distribution plate with UV blocker at the center

Ramaswamy Kartik; Willwerth Michael D.; Yang Yang

11449026

Variable loop control feature

Shankaramurthy Venkatanarayana; Baryshnikov Anton; Berens Brett; Sanghvi Mite【我.爱.线.报.网.】sh; Liu Shuang

11450504

GeH₄/Ar plasma chemistry for ion implant productivity enhancement

Koo Bon-Woong; Sarajlic Ajdin; Johnson Ronald; Carbone Nunzio V.; Ewing Peter; Deegan Mervyn

11450509

Inductive plasma source with metallic shower head using b-field concentrator

Lai Canfeng; Tobin Jeffrey【我.爱.线.报.网.】; Porshnev Peter I.; Marin Jose Antonio

11450511

Methods and apparatus for zone control of RF bias for stress uniformity

Sun Lizhong; Yang Yi; Chen Jian Janson; Ma Chong; Yang Xiaodong

11450514

Methods of reducing particles in a physical vapor deposition (PVD) chamber

Dou Wei; Cao Yong; Li Mingdong; Lavan【我.爱.线.报.网.】 Shane; Ramalingam Jothilingam; Liu Chengyu

11450525

Selective aluminum oxide film deposition

Wu Liqi; Nguyen Hung; Bhuyan Bhaskar Jyoti; Saly Mark; Liu Feng Q.; Thompson David

11450539

Substrate processing systems, apparatus, and methods with factory interface environmental controls

Koshti Sushant S.; Hr【我.爱.线.报.网.】uzek Dean C.; Majumdar Ayan; Menk John C.; Lee Helder T.; Patil Sangram; Rajaram Sanjay; Baumgarten Douglas B.; Merry Nir

11450546

Semiconductor substrate support with internal channels

Parkhe Vijay D.

11450759

Gate all around I/O engineering

Hung Steven C. H.; Colombeau Benjamin; Lo Andy; Lee Byeong Chan【我.爱.线.报.网.】; Swenberg Johanes F.; Guarini Theresa Kramer; Bevan Malcolm J.

11453097

Chemical mechanical polishing apparatus and methods

Bajaj Rajeev; Osterheld Thomas H.; Chen Hung; Lee Terrance Y.

11453099

Retaining ring having inner surfaces with features

Reedy Steven Mark; Yavelberg Simon; Oh Jeonghoon; Zuniga St【我.爱.线.报.网.】even M.; Nagengast Andrew J.; Hsu Samuel Chu-Chiang; Dandavate Gautam Shashank

11454876

EUV mask blank absorber defect reduction

Varghese Binni; Jindal Vibhu; Zerrade Azeddine; Liu Shiyu; Ramalingam Ramya

11454884

Fluoropolymer stamp fabrication method

Gouk Roman; Delmas Jean; Verhaverbeke Steven; Buch Ch【我.爱.线.报.网.】intan

11456152

Modulation of rolling K vectors of angled gratings

Olson Joseph C.; Evans Morgan; Meyer Timmerman Thijssen Rutger

11456161

Substrate support pedestal

Larosa Steven Joseph; Prouty Stephen

11456171

Deep trench integration processes and devices

Yu Lan; Sherwood Tyler

11456173

Methods for modifying 【我.爱.线.报.网.】photoresist profiles and tuning critical dimensions

Gupta Meenakshi; Cheng Rui; Guggilla Srinivas; Janakiraman Karthik; Kedlaya Diwakar N.; Huang Zubin

11456178

Gate interface engineering with doped layer

Hung Steven C. H.; Colombeau Benjamin; Dube Abhishek; Kung Sheng-Chin; Liu Patricia M.; Bevan Malco【我.爱.线.报.网.】lm J.; Swenberg Johanes F.

11456179

Methods for forming semiconductor device having uniform fin pitch

Sung Min Gyu

11456197

Systems and methods for providing maintenance access to electronic device manufacturing tools

Rice Michael R.; Rocha-Alvarez Juan Carlos; Hudgens Jeffrey C.

11456205

Methods for variab【我.爱.线.报.网.】le etch depths

Evans Morgan; Olson Joseph C.; Meyer Timmerman Thijssen Rutger; Distaso Daniel; Boas Ryan

11456301

Dram and method of making

Kumar Arvind; Pakala Mahendra; Manhas Sanjeev; Gautam Satendra Kumar

11456345

Conductive oxide overhang structures for OLED devices

Choung Ji-young; Chen Chung-Chia; L【我.爱.线.报.网.】in Yu Hsin; Lee Jungmin; Haas Dieter; Kim Si Kyoung

11459347

Molybdenum(IV) and molybdenum(III) precursors for deposition of molybdenum films

Leoncini Andrea; Mehlmann Paul; Dordevic Nemanja; Huynh Han Vinh; Yong Doreen Wei Ying

11459651

Paste method to reduce defects in dielectric sputtering

Wang Xiaodon【我.爱.线.报.网.】g; Wang Rongjun; Wu Hanbing

11459652

Techniques and device structures based upon directional dielectric deposition and bottom-up fill

Zeeshan M. Arif; Ma Tristan Y.; Chan Kelvin

11460413

Apparatus and method for inspecting lamps

Raj Govinda; Nestorov Vilen K.

11462386

Electron beam apparatus for optical dev【我.爱.线.报.网.】ice fabrication

Ramaswamy Kartik; Yang Yang; Thothadri Manivannan; Chen Chien-An; Godet Ludovic; Meyer Timmerman Thijssen Rutger

11462388

Plasma processing assembly using pulsed-voltage and radio-frequency power

Dorf Leonid; Dhindsa Rajinder; Rogers James; Byun Daniel Sang; Kamenetskiy Evgeny; Guo Yue; 【我.爱.线.报.网.】Ramaswamy Kartik; Todorow Valentin N.; Luere Olivier; Cui Linying

11462389

Pulsed-voltage hardware assembly for use in a plasma processing system

Dorf Leonid; Dhindsa Rajinder; Rogers James; Byun Daniel Sang; Kamenetskiy Evgeny; Guo Yue; Ramaswamy Kartik; Todorow Valentin N.; Luere Olivier; Kolbeck Jon【我.爱.线.报.网.】athan; Cui Linying

11462396

Lamp cross-section for reduced coil heating

Ranish Joseph M.

11462411

Gate contact over active regions

Thareja Gaurav; Kashefizadeh Keyvan; Wang Xikun; Wang Anchuan; Natarajan Sanjay; Seutter Sean M.; Wu Dong

11462417

High pressure and high temperature anneal chamber

Delmas Jean; 【我.爱.线.报.网.】Verhaverbeke Steven; Leschkies Kurtis

11462426

Methods and assemblies for gas flow ratio control

Brashear Kevin; Okada Ashley M.; Demars Dennis L.; Ye Zhiyuan; Rajaram Jaidev; Josephson Marcel E.

11462438

Volumetric expansion of metal-containing films by silicidation

Roy Susmit Singha; Gandikota Srinivas;【我.爱.线.报.网.】 Mallick Abhijit Basu; Mullick Amrita B.

11462630

Conformal halogen doping in 3D structures using conformal dopant film deposition

Cheng Rui; Yang Yi; Janakiraman Karthik; Mallick Abhijit Basu

11462733

Ex-situ solid electrolyte interface modification using chalcogenides for lithium metal anode

Gopalakrish【我.爱.线.报.网.】nan Nair Girish Kumar; Herle Subramanya P.; Armstrong Karl J.

11466364

Methods for forming protective coatings containing crystallized aluminum oxide

Ohno Kenichi; Liu Eric H.; Chatterjee Sukti; Melnik Yuriy; Knisley Thomas; Britz David Alexander; Scudder Lance A.; Narwankar Pravin K.

11467499

System and【我.爱.线.报.网.】 method of measuring refractive index of EUV mask absorber

Xiao Wen; Jindal Vibhu; Liu Huajun; Yoong Herng Yau

11467508

Pellicle adhesive residue removal system and methods

Wu Banqiu; Dagan Eli

11469075

Identifying fiducial markers in microscope images

Chang Yun-Ching

11469080

Magnetron assembly having coola【我.爱.线.报.网.】nt guide for enhanced target cooling

Huderi Somanna Dinkesh; West Brian T.; Oh Jeonghoon

11469096

Method and chamber for backside physical vapor deposition

Zhou Chunming; Ramalingam Jothilingam; Cao Yong; Moraes Kevin Vincent; Lavan Shane

11469097

Carbon hard masks for patterning applications and methods 【我.爱.线.报.网.】related thereto

Venkatasubramanian Eswaranand; Yang Yang; Manna Pramit; Ramaswamy Kartik; Koshizawa Takehito; Mallick Abhijit Basu

11469100

Methods of post treating dielectric films with microwave radiation

Sun Yong; Jha Praket Prakash; Liang Jingmei; Seamons Martin Jay; Li DongQing; Sharma Shashank; Ma【我.爱.线.报.网.】yur Abhilash J.; Aderhold Wolfgang R.

11469107

Highly etch selective amorphous carbon film

Prasad Rajesh; Bobek Sarah; Kulshreshtha Prashant Kumar; Lee Kwangduk Douglas; Whitesell Harry; Oshio Hidetaka; Lee Dong Hyung; Raj Mittal Deven Matthew; Falk Scott; Chavva Venkataramana R.

11469113

High pressure a【我.爱.线.报.网.】nd high temperature anneal chamber

Delmas Jean; Verhaverbeke Steven; Leschkies Kurtis

11469123

Mapping of a replacement parts storage container

Bergantz Nicholas Michael; Hudgens Jeffrey; McAllister Doug; Lee Helder

11469124

Contactless latch and coupling for vacuum wafer transfer cassette

Patil Shanthavee【我.爱.线.报.网.】raswamy Shreyas; Gautam Ribhu; Nagarajan Kumaresan; Singh Vijay; Constant Andrew J.; Karazim Michael P.; Vellore Kim Ramkumar

11470956

Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process

Bajaj Rajeev

11471999

Integrated abrasive polishing pads an【我.爱.线.报.网.】d manufacturing methods

Kumar Ashavani; Chockalingam Ashwin; Ganapathiappan Sivapackia; Bajaj Rajeev; Fu Boyi; Redfield Daniel; Patibandla Nag B.; Cornejo Mario Dagio; Sinha Amritanshu; Zhao Yan; Arnepalli Ranga Rao; Redeker Fred C.

11473189

Method for particle removal from wafers through plasma modifi【我.爱.线.报.网.】cation in pulsed PVD

Chong Halbert; Zhou Lei; Allen Adolph Miller; Soni Vaibhav; Kalathiparambil Kishor; Faune Vanessa; Suh Song-Moon

11473191

Method for creating a dielectric filled nanostructured silica substrate for flat optical devices

Roy Tapashree; Meyer Timmerman Thijssen Rutger; Godet Ludovic; F【我.爱.线.报.网.】u Jinxin

11473198

Homoleptic lanthanide deposition precursors

Knisley Thomas; Saly Mark

11473978

Enhanced substrate temperature measurement apparatus, system and method

Sun Dawei; Lischer D. Jeffrey; Chen Qin; Stone Dale K.; Stone Lyudmila; Anella Steven; Serisky Ron; Cheng Chi-Yang

11476084

Apparatus and t【我.爱.线.报.网.】echniques for ion energy measurement in pulsed ion beams

Lee W. Davis

11476087

Ion implantation system and linear accelerator having novel accelerator stage configuration

Sinclair Frank

11476090

Voltage pulse time-domain multiplexing

Ramaswamy Kartik; Yang Yang; Guo Yue

11476093

Plasma etching systems and me【我.爱.线.报.网.】thods with secondary plasma injection

Tran Toan Q.; Park Soonam; Weng Zilu; Lubomirsky Dmitry

11476097

Common electrostatic chuck for differing substrates

Ramachandran Vinodh; Jupudi Ananthkrishna; Babu Sarath

11476135

Robot for simultaneous substrate transfer

Carlson Charles T.; Schaller Jason M.; Bonecut【我.爱.线.报.网.】ter Luke; Blahnik David

11476145

Automatic ESC bias compensation when using pulsed DC bias

Rogers James; Cui Linying; Dorf Leonid

11476146

Substrate support assembly with deposited surface features

Boyd, Jr. Wendell Glenn; Parkhe Vijay D.; Kuo Teng-Fang; Ding Zhenwen

11476202

Reconstituted substrate structu【我.爱.线.报.网.】re and fabrication methods for heterogeneous packaging integration

Chen Han-Wen; Verhaverbeke Steven; See Guan Huei; Park Giback; Cellere Giorgio; Tonini Diego; Dicaprio Vincent; Cho Kyuil

11476267

Liner for V-NAND word line stack

Wrench Jacqueline S.; Yang Yixiong; Wu Yong; Tang Wei V.; Gandikota Srini【我.爱.线.报.网.】vas; Lin Yongjing; Bernal Ramos Karla M; Chen Shih Chung

11476313

Methods of fabricating OLED panel with inorganic pixel encapsulating barrier

Choung Ji-young; Haas Dieter; Lin Yu Hsin; Lee Jungmin; Yoo Seong Ho; Kim Si Kyoung

11476330

System and technique for creating implanted regions using multiple ti【我.爱.线.报.网.】lt angles

Chavva Venkataramana R.; Gossmann Hans-Joachim

11478894

Polishing fluid additive concentration measurement apparatus and methods related thereto

Wiswell Nicholas Alexander

11479855

Spatial wafer processing with improved temperature uniformity

AuBuchon Joseph; Baluja Sanjeev; Kashyap Dhritiman Sub【我.爱.线.报.网.】ha; Lee Jared Ahmad; Ulavi Tejas; Rice Michael

11479857

Clean isolation valve for reduced dead volume

Agarwal Ashutosh; Baluja Sanjeev

11479859

High temperature vacuum seal

Mustafa Muhannad; Rasheed Muhammad M.

11480712

Non-absorptive trans-reflective nanostructured RGB filters

Roy Tapashree; Meyer Timmerman【我.爱.线.报.网.】 Thijssen Rutger; Visser Robert Jan

11480724

Variable height slanted grating method

Evans Morgan; Meyer Timmerman Thijssen Rutger

11480865

Method and apparatus to improve EUV mask blank flatness

Jindal Vibhu; Bhat Sanjay; Xiao Wen; Ramachandran Vinodh

11480866

Method and apparatus to anneal EUV mask blank

Yo【我.爱.线.报.网.】ong Herng Yau; Xiao Wen; Gautam Ribhu; Bhat Sanjay; Jindal Vibhu

11482397

High output ion source, ion implanter, and method of operation

Chaney Craig Richard; Sinclair Frank; Tieger Daniel R.

11482402

Methods and apparatus for processing a substrate

Dorf Leonid; Dhindsa Rajinder; Luere Olivier; Kamenetski【我.爱.线.报.网.】y Evgeny

11482432

Method and apparatus for semiconductor processing

Sanchez Errol Antonio C.

11482444

High temperature micro-zone electrostatic chuck

Parkhe Vijay D.

11482562

Methods for forming image sensors

Chen Taichou Papo

11484987

Maintenance methods for polishing systems and articles related thereto

Gadgi【我.爱.线.报.网.】l Shantanu Rajiv; Patankar Sumit Subhash; Davis Nathan Arron; Coughlin Michael J.; DAmbra Allen L.

11486038

Asymmetric injection for better wafer uniformity

Shono Eric Kihara; Pandey Vishwas Kumar; Olsen Christopher S.; Shah Kartik; Lo Hansel; Kaufman-Osborn Tobin; George Rene; Hawrylchak Lara; Hansen 【我.爱.线.报.网.】Erika

11486927

Bode fingerprinting for characterizations and failure detections in processing chamber

Zhang Tao; Ummethala Upendra V.; Balakrishna Ajit

11487058

Method for manufacturing optical device structures

Colak Levent; Godet Ludovic; Labonte Andre P.

11487139

Nanostructures for optical devices

Roy Tap【我.爱.线.报.网.】ashree; McMillan Wayne; Meyer Timmerman Thijssen Rutger

11487304

Process fluid path switching in recipe operations

Sanghvi Mitesh; Shankaramurthy Venkatanarayana; Standish Peter; Baryshnikov Anton; Kril Thorsten; Neema Chahal; Jamakhandi Vishal Suresh; Kangude Abhijit Ashok

11487848

Process abnormality i【我.爱.线.报.网.】dentification using measurement violation analysis

Nahas Selim; Dox Joseph James; Ragam Vishali; Warren Eric J.; Wang Shijing; Largo Charles; Reeves Christopher; Corral Randy Raynaldo

11488796

Thermal break for high-frequency antennae

Chua Thai Cheng; Nguyen Hanh; Kraus Philip Allan

11488806

L-motion slit【我.爱.线.报.网.】 door for substrate processing chamber

Noorbakhsh Hamid

11488811

Chucking process and system for substrate processing chambers

Kumar Bhaskar; Balasubramanian Ganesh; Shah Vivek Bharat; Zhao Jiheng

11488812

Method and apparatus for reducing particle defects in plasma etch chambers

Wang Xikun; Nguyen Andrew;【我.爱.线.报.网.】 Lee Changhun; He Xiaoming; Shen Meihua

11488830

Oxygen free deposition of platinum group metal films

Yang Yixiong; Tang Wei V.; Ganguli Seshadri; Yu Sang Ho; Liu Feng Q.; Anthis Jeffrey W.; Thompson David; Wrench Jacqueline S.; Yoshida Naomi

11488835

Systems and methods for tungsten-containing film remo【我.爱.线.报.网.】val

Cui Zhenjiang; Reddy Rohan Puligoru; Wang Anchuan

11488852

Methods and apparatus for reducing high voltage arcing in semiconductor process chambers

Husain Anwar; Noorbakhsh Hamid; Ramaswamy Kartik

11488856

Methods for gapfill in high aspect ratio structures

Manna Pramit; Godet Ludovic; Cheng Rui; Chen 【我.爱.线.报.网.】Erica; Duan Ziqing; Mallick Abhijit Basu; Gandikota Srinivas

11488935

Scalable network-on-package for connecting chiplet-based designs

Zaman Naveed; Shak Myron; Suri Tameesh; Sheikh Bilal Shafi

11489105

Physical vapor deposition of piezoelectric films

Sangle Abhijeet Laxman; Sharma Vijay Bhan; Kadam Ankur【我.爱.线.报.网.】; Ramakrishnan Bharatwaj; Sivaramakrishnan Visweswaren; Xue Yuan

11489110

Methods for treating magnesium oxide film

Wang Xiaodong; Whig Renu; Lei Jianxin; Wang Rongjun

11490466

Melt depth determination using infrared interferometric technique in pulsed laser annealing

Li Jiping

11492697

Apparatus for improv【我.爱.线.报.网.】ed anode-cathode ratio for rf chambers

Savandaiah Kirankumar Neelasandra; Miller Keith A.; Yedla Srinivasa Rao; Kenchappa Chandrashekar; Riker Martin Lee

11492698

Optically transparent pedestal for fluidly supporting a substrate

Aderhold Wolfgang R.; Mayur Abhilash J.

11492699

Substrate temperature non-un【我.爱.线.报.网.】iformity reduction over target life using spacing compensation

Bangalore Umesh Suhas; Rao Preetham; Pethe Shirish A.; Zhang Fuhong; Kalathiparambil Kishor Kumar; Riker Martin Lee; Zhong Lanlan

11492704

Chamber injector

Lau Shu-Kwan; Lam Lit Ping; Rao Preetham; Shah Kartik; Ong Ian; Myo Nyi O.; Burrows B【我.爱.线.报.网.】rian H.

11492705

Isolator apparatus and methods for substrate processing chambers

Pathak Nitin; Bansal Amit Kumar; Nguyen Tuan Anh; Rubio Thomas; Ramamurthi Badri N.; Rocha-Alvarez Juan Carlos

11493841

Glass ceramic for ultraviolet lithography and method of manufacturing thereof

Hofmann Ralf; Foad Majeed 【我.爱.线.报.网.】A.; Beasley Cara

11495430

Tunable extraction assembly for wide angle ion beam

Wallace Jay R.; Biloiu Costel; Daniels Kevin M.

11495440

Plasma density control on substrate edge

Kumar Bhaskar; Kothnur Prashanth; Bhatia Sidharth; Singh Anup Kumar; Shah Vivek Bharat; Balasubramanian Ganesh; Wang Changgong

1149【我.爱.线.报.网.】5454

Deposition of low-stress boron-containing layers

Wang Huiyuan; Kustra Rick; Qi Bo; Mallick Abhijit Basu; Alayavalli Kaushik; Pinson Jay D.

11495461

Film stack for lithography applications

Singh Tejinder; Parikh Suketu Arun; Diehl Daniel Lee; Stolfi Michael Anthony; Ramalingam Jothilingam; Cao Yong; 【我.爱.线.报.网.】Yan Lifan; Lang Chi-I; Hwang Hoyung David

11495470

Method of enhancing etching selectivity using a pulsed plasma

Zhou Hailong; Kang Sean; Takeshita Kenji; Dhindsa Rajinder; Lee Taehwan; Kwak Iljo

11495479

Light pipe window structure for thermal chamber applications and processes

Ranish Joseph M.; Hunter A【我.爱.线.报.网.】aron Muir; Chang Anzhong

11495483

Backside gas leakby for bevel deposition reduction

Parimi Venkata Sharat Chandra; Kedlaya Diwakar

11495500

Horizontal GAA nano-wire and nano-slab transistors

Colombeau Benjamin; Gossmann Hans-Joachim

11495932

Slip ring for use in rotatable substrate support

Mustafa Muhannad;【我.爱.线.报.网.】 Chang Yu; Kuang William; Rasheed Muhammad M.; Huo Xiping

11498213

Robot joint space graph path planning and move execution

Abdul-hadi Omar; Cranmer Adam Christopher; Freeman Gregory John

11499223

Continuous liner for use in a processing chamber

Carducci James D.; Collins Kenneth S.; Ramaswamy Kartik

11499【我.爱.线.报.网.】229

Substrate supports including metal-ceramic interfaces

Ramalingam Chidambara A.; Rocha Juan Carlos; Polese Joseph M.; Guyomard Katty Marie Lydia Gamon; Li Jian

11499231

Lid stack for high frequency processing

Sheng Shuran; Zhang Lin; Werner Joseph C.

11499666

Precision dynamic leveling mechanism with lo【我.爱.线.报.网.】ng motion capability

Schaller Jason M.; Rohrer Michael P.; Nguyen Tuan Anh

11499869

Optical wall and process sensor with plasma facing sensor

Lin Chuang-Chia; Ummethala Upendra

11501945

Side inject designs for improved radical concentrations

Shono Eric Kihara; Pandey Vishwas Kumar; Olsen Christopher S.; Lo【我.爱.线.报.网.】 Hansel; Tjandra Agus Sofian; Kim Taewan; Kaufman-Osborn Tobin

11501954

Dogbone inlet cone profile for remote plasma oxidation chamber

Pandey Vishwas Kumar; Shah Kartik; Olsen Christopher S.; Tjandra Agus Sofian; Lo Hansel; Shono Eric Kihara; Raju Hemantha

11501955

Modular high-frequency source with inte【我.爱.线.报.网.】grated gas distribution

Nguyen Hanh; Chua Thai Cheng; Kraus Philip Allan

11501957

Pedestal support design for precise chamber matching and process control

Krishna Gopu; Polyak Alexander S.; Baluja Sanjeev

11501972

Sacrificial capping layer for passivation using plasma-based implant process

Bhosle Vikram M.【我.爱.线.报.网.】; Bateman Nicholas P. T.; Miller Timothy J.; Lee Jun Seok; Mittal Deven Raj

11501986

Wafer profiling for etching system

Cheung Jeffrey Chi; Ghekiere John; Leonhard Jerry D.; Surdock David P.; Shafer Benjamin; Young Ray

11501993

Semiconductor substrate supports with improved high temperature chucking

Li Ji【我.爱.线.报.网.】an; Rocha-Alvarez Juan Carlos; Ye Zheng John; Benjamin Raj Daemian Raj; Srivastava Shailendra; Han Xinhai; Padhi Deenesh; Hu Kesong; Wang Chuan Ying

11504821

Predictive filter for polishing pad wear rate monitoring

Dhandapani Sivakumar; Qian Jun

11505863

Methods for forming films on substrates

Lerner Alex【我.爱.线.报.网.】ander N.; Shaviv Roey; Kothnur Prashanth; Radhakrishnan Satish; Che Xiaozhou

11507824

Training spectrum generation for machine learning system for spectrographic monitoring

Cherian Benjamin; Wiswell Nicholas; Qian Jun; Osterheld Thomas H.

11508554

High voltage filter assembly

Mishra Anurag Kumar; Rogers J【我.爱.线.报.网.】ames; Dorf Leonid; Dhindsa Rajinder; Luere Olivier

11508558

Thermal repeatability and in-situ showerhead temperature monitoring

Franklin Timothy Joseph; Babayan Steven E.; Kraus Philip Allan

11508563

Methods and apparatus for processing a substrate using improved shield configurations

Jembulingam Soundarr【我.爱.线.报.网.】ajan; Chen Jian Janson; Oh Jeonghoon

11508584

Deuterium-containing films

Seutter Sean M.; Park Mun Kyu; Le Hien M; Chuang Chih-Chiang

11508593

Side storage pods, electronic device processing systems, and methods for operating the same

Reuter Paul B.; Hruzek Dean C.

11508595

Apparatus and method for contactl【我.爱.线.报.网.】ess transportation of a device in a vacuum processing system

Aust Henning; Schuler Jörg

11508610

Substrate support with edge seal

Ke Chang; Chia Bonnie; Suh Song-Moon; Tsai Cheng-Hsiung; Guo Yuanhong; Zhou Lei; Langtry David

11508611

Enhanced lift pin design to eliminate local thickness non-uniformity in 【我.爱.线.报.网.】teos oxide films

Ghosh Kalyanjit; Kulkarni Mayur G.; Baluja Sanjeev; Jha Praket P.; Nittala Krishna

11508617

Method of forming interconnect for semiconductor device

Jiang Hao; Lu Chi; Ren He; Lang Chi-I; Hwang Ho-yung David; Naik Mehul

11508618

Multicolor self-aligned contact selective etch

Lin Yung-Chen; 【我.爱.线.报.网.】Zhou Qingjun; Zhang Ying; Hwang Ho-yung David

11508828

Selective silicon etch for gate all around transistors

Stolfi Michael; Kim Myungsun; Colombeau Benjamin; Natarajan Sanjay

11508988

Lithium anode device stack manufacturing

Herle Subramanya P.

11511388

Polishing system with support post and annular plate【我.爱.线.报.网.】n or polishing pad

Butterfield Paul D.; Osterheld Thomas H.; Oh Jeonghoon; Chang Shou-Sung; Zuniga Steven M.; Redeker Fred C.

11511390

Pivotable substrate retaining ring

Zuniga Steven M.; Gurusamy Jay; Nagengast Andrew J.

11511950

Substrate flipping device

Phan Michael Minh; Tindel Steven Trey; Reuter Paul【我.爱.线.报.网.】 Benjamin

11512385

Method of forming gratings

Olson Joseph C.; Godet Ludovic; Meyer Timmerman Thijssen Rutger; Evans Morgan; Fu Jinxin

11512387

Methods and apparatus for passivating a target

Du Chao; Chen Xing; Miller Keith A.; Ramalingam Jothilingam; Lei Jianxin

11512391

Process kit for a high throughput p【我.爱.线.报.网.】rocessing chamber

Ghosh Kalyanjit; Kulkarni Mayur G.; Baluja Sanjeev; Chuc Kien N.; Kim Sungjin; Wang Yanjie

11513437

Extreme ultraviolet mask absorber materials

Liu Shiyu; Liu Shuwei; Jindal Vibhu

11513504

Characterizing and monitoring electrical components of manufacturing equipment

Paul David John

115151【我.爱.线.报.网.】29

Radiation shield modification for improving substrate temperature uniformity

Neville Elizabeth; Radhakrishnan Satish; Shah Kartik; Prabhakar Vinay; Parimi Venkata Sharat Chandra; Ha Sungwon

11515130

Fast response pedestal assembly for selective preclean

Hawrylchak Lara; Prasad Chaitanya A.

11515132

Phys【我.爱.线.报.网.】ical vapor deposition processing systems target cooling

Bhat Sanjay; Jindal Vibhu; Pandey Vishwas Kumar

11515144

In-situ film annealing with spatial atomic layer deposition

Tanaka Keiichi; Short Andrew; Sriram Mandyam; Gandikota Srinivas

11515145

Deposition of silicon boron nitride films

Yang Chuanxi; Yu H【我.爱.线.报.网.】ang; Padhi Deenesh

11515149

Deposition of flowable silicon-containing films

Kalutarage Lakmal C.; Saly Mark; Thompson David; Mallick Abhijit Basu; Ashok Tejasvi; Manna Pramit

11515150

Hardmask tuning by electrode adjustment

Tsiang Michael Wenyoung; Khaja Abdul Aziz; Xia Li-Qun; Hsiao Kevin; Hu Liangfa; Ch【我.爱.线.报.网.】eng Yayun

11515151

Methods and precursors for selective deposition of metal films

Fredrickson Kurt; Basu Atashi; Balseanu Mihaela; Li Ning

11515154

Selective deposition of a passivation film

Leoncini Andrea; Wang Yong; Yong Doreen Wei Ying

11515155

Methods for enhancing selectivity in SAM-based selective de【我.爱.线.报.网.】position

Ke Chang; Jackson Michael S.; Wu Liqi; Zhou Lei; Zhang Shuyi; Thompson David; Ma Paul F.; Liu Biao; Pan Cheng

11515156

Methods for depositing blocking layers on conductive surfaces

Bhuyan Bhaskar Jyoti; Saly Mark; Liu Wenyi

11515163

Low temperature graphene growth

Wang Jialiang; Singha Roy Susmit;【我.爱.线.报.网.】 Mallick Abhijit Basu; Ingle Nitin K.

11515166

Cryogenic atomic layer etch with noble gases

Garcia De Gorordo Alvaro; Yao Zhonghua; Srinivasan Sunil; Park Sang Wook

11515170

3D NAND etch

Jiang Shishi; Manna Pramit; Qi Bo; Mallick Abhijit Basu; Cheng Rui; Kitajima Tomohiko; Whitesell Harry S.; Wang Huiyuan【我.爱.线.报.网.】

11515176

Thermally controlled lid stack components

Chandrasekar Siva; Radhakrishnan Satish; Hiriyannaiah Rajath Kumar Lakkenahalli; Kalsekar Viren; Prabhakar Vinay

11515179

Semiconductor processing chamber multistage mixing apparatus

Samir Mehmet Tugrul; Yang Dongqing

11515191

Graded dimple height pattern 【我.爱.线.报.网.】on heater for lower backside damage and low chucking voltage

Shah Vivek B.; Kumar Bhaskar; Balasubramanian Ganesh

11515195

Semiconductor chamber components with high-performance coating

Kalita Laksheswar

11515200

Selective tungsten deposition within trench structures

Xu Yi; Hu Yufei; Ren He; Lei Yu; You Sh【我.爱.线.报.网.】i; Daito Kazuya

11515207

Methods of forming metal chalcogenide pillars

Mullick Amrita B.; Gandikota Srinivas

11515218

Thermal profile monitoring wafer and methods of monitoring temperature

Jadhav Deepak

11515324

3D NAND structures with decreased pitch

Kwon Thomas; Han Xinhai

11518097

Selective powder dispenser【我.爱.线.报.网.】 configurations for additive manufacturing

Zehavi Raanan; Ng Hou T.; Patibandla Nag B.; Joshi Ajey M.

11518100

Additive manufacturing with a polygon scanner

Lei Wei-Sheng; Chidambaram Mahendran; Sivaramakrishnan Visweswaren; Maqsood Kashif

11519066

Nitride protective coatings on aerospace components and m【我.爱.线.报.网.】ethods for making the same

Britz David Alexander; Scudder Lance A.; Melnik Yuriy; Chatterjee Sukti

11519071

Method for fabricating chamber parts

Peng Gang Grant; Groechel David W.; Wang Han

11519773

Methods, systems, and apparatus for mass flow verification based on choked flow

Brashear Kevin M.; Ye Zhiyua【我.爱.线.报.网.】n; Hough Justin; Rajaram Jaidev; Josephson Marcel E.; Okada Ashley M.

11520358

Gas-pulsing-based shared precursor distribution system and methods of use

Rice Michael; AuBuchon Joseph; Baluja Sanjeev; Okada Ashley M.; Fernandez Alexander; Xu Ming; Josephson Marcel E.; Koshti Sushant Suresh; Le Kenneth; 【我.爱.线.报.网.】Brashear Kevin M.

11521828

Inductively coupled plasma source

Rogers James; Poulose John

11521830

Ceramic coated quartz lid for processing chamber

Hwang Bernard L.

11521838

Integrated cleaning process for substrate etching

Zhou Yi; Ahn Seul Ki; Son Seung-Young; Chang Li-Te; Srinivasan Sunil; Dhindsa Rajinder

1【我.爱.线.报.网.】1521839

Inline measurement of process gas dissociation using infrared absorption

Gopalan Ramesh; Salimian Siamak

11521849

In-situ deposition process

Park Sang Wook; Srinivasan Sunil; Dhindsa Rajinder; Kim Jonathan Sungehul; Yu Lin; Yao Zhonghua; Luere Olivier

11521870

Annealing chamber

Kamesh Giridhar

115218【我.爱.线.报.网.】72

Method and apparatus for measuring erosion and calibrating position for a moving process kit

Potter Charles G.; Mor Eli; Lopez Carbajal Sergio

11521935

Package structure and fabrication methods

Chen Han-Wen; Verhaverbeke Steven; Park Giback; Cellere Giorgio; Tonini Diego; Dicaprio Vincent; Cho Kyuil

11【我.爱.线.报.网.】521937

Package structures with built-in EMI shielding

Verhaverbeke Steven; Chen Han-Wen; Park Giback; Buch Chintan

11522126

Magnetic tunnel junctions with protection layers

Xue Lin; Ahn Jaesoo; Patel Sahil; Park Chando; Pakala Mahendra

11524382

Polishing apparatus using machine learning and compensation fo【我.爱.线.报.网.】r pad thickness

Xu Kun; Ivanov Denis; Lee Harry Q.; Qian Jun

11524384

Abrasive delivery polishing pads and manufacturing methods thereof

Chockalingam Ashwin; Bajaj Rajeev; Kumar Ashavani; Redfield Daniel

11524392

Minimal contact gripping of thin optical devices

Ahamed Yaseer Arafath; Wang Kangkang; Riordon【我.爱.线.报.网.】 Benjamin B.; Strassner James D.; Godet Ludovic

11524455

Removable unit for selective powder delivery for additive manufacturing

Zehavi Raanan; Ng Hou T.; Patibandla Nag B.; Joshi Ajey M.

11527407

Vapor deposition of carbon-based films

Bhuyan Bhaskar Jyoti; Leoncini Andrea

11527408

Multiple spacer patternin【我.爱.线.报.网.】g schemes

Yang Tzu-shun; Cheng Rui; Janakiraman Karthik; Huang Zubin; Kedlaya Diwakar; Gupta Meenakshi; Guggilla Srinivas; Lin Yung-chen; Oshio Hidetaka; Li Chao; Lee Gene

11527412

Method for increasing photoresist etch selectivity to enable high energy hot implant in SiC devices

Zhang Qintao; Hong Samp【我.爱.线.报.网.】hy; Lee David J.; Levitov Felix; Zhong Lei; Zou Wei

11527414

Methods for etching structures with oxygen pulsing

Fung Nancy; Alva Gabriela

11527424

Substrate transfer systems and methods of use thereof

Berger Alex; Hudgens Jeffrey; Englhardt Eric

11527429

Substrate support assembly for high temperature proce【我.爱.线.报.网.】sses

Parkhe Vijay D.

11527437

Methods and apparatus for intermixing layer for enhanced metal reflow

Zhong Lanlan; Zhang Fuhong; Shen Gang; Chen Feng; Li Rui; Xie Xiangjin; Ha Tae Hong; Tang Xianmin

11527637

Ion implantation to control formation of MOSFET trench-bottom oxide

Zhang Qintao; Hong Samphy

1152773【我.爱.线.报.网.】2

OLED anode structures including amorphous transparent conducting oxides and OLED processing method comprising the same

Chen Chung-Chia; Lin Yu-Hsin; Lee Jungmin; Kato Takuji; Haas Dieter; Kim Si Kyoung; Choung Ji Young

11529592

Gas injector with baffle

Pandey Vishwas Kumar; Hawrylchak Lara; Shono Eric 【我.爱.线.报.网.】Kihara; Shah Kartik; Olsen Christopher S.; Tallavarjula Sairaju; Pradhan Kailash; George Rene; Swenberg Johanes F.; Moffatt Stephen

11530477

Cycloheptatriene molybdenum (0) precursors for deposition of molybdenum films

Leoncini Andrea; Mehlmann Paul; Dordevic Nemanja; Huynh Han Vinh; Yong Doreen Wei Yi【我.爱.线.报.网.】ng

11530478

Method for forming a hydrophobic and icephobic coating

Bajaj Rajeev; Chang Mei; Padhi Deenesh

11530480

Injector for batch processing and methods of use

Yudovsky Joseph; Griffin Kevin; Sriram Mandyam

11530482

Faceplate having a curved surface

Srivastava Shailendra; Addepalli Sai Susmita; Jorapur N【我.爱.线.报.网.】ikhil Sudhindrarao; Benjamin Raj Daemian Raj; Bansal Amit Kumar; Rocha-Alvarez Juan Carlos; Chichkanoff Gregory Eugene; Han Xinhai; Ogata Masaki; Enslow Kristopher; Wang Wenjiao

11530751

Closure mechanism vacuum chamber isolation device and sub-system

Nguyen Tuan Anh

11532418

RF choke for gas delivery to【我.爱.线.报.网.】 an RF driven electrode in a plasma processing apparatus

Kudela Jozef; Sorensen Carl A.; White John M.

11532462

Method and system for cleaning a process chamber

Ghosh Kalyanjit; Srivastava Shailendra; Ulavi Tejas; Zhou Yusheng; Bansal Amit Kumar; Baluja Sanjeev

11532463

Semiconductor processing chamber an【我.爱.线.报.网.】d methods for cleaning the same

Pandey Vishwas Kumar; Prabhakar Vinay K.; Afzal Bushra; Ramamurthi Badri N.; Rocha-Alvarez Juan Carlos

11532464

Reactor design for large-area VHF plasma processing with improved uniformity

Sheng Shuran; Abe Shinobu; Kuwahara Keita; Shin Chang Hee; Cho Su Ho

11532466

Part-li【我.爱.线.报.网.】fe estimation utilizing feature metrology

Liao Chien-Min; Yang Yao-Hung; Cho Tom K.; Salimian Siamak; Yang Hsiu; Chen Chun-Chung

11532474

Deposition of rhenium-containing thin films

Knisley Thomas; Woods Keenan N.; Saly Mark; Winter Charles H.; Cwik Stefan

11532497

High power electrostatic chuck design wi【我.爱.线.报.网.】th radio frequency coupling

Cho Jaeyong; Parkhe Vijay D.; Wang Haitao; Ramaswamy Kartik; Zhang Chunlei

11532525

Controlling concentration profiles for deposited films using machine learning

Baryshnikov Anton V; Aydin Aykut; Huang Zubin; Cheng Rui; Yang Yi; Kedlaya Diwakar; Shankaramurthy Venkatanarayana【我.爱.线.报.网.】; Nittala Krishna; Janakiraman Karthik

11532808

Pre-lithiation process for electrode by dry direct contact to lithium targets

Brevnov Dmitri A.

11533783

Multi-zone heater model-based control in semiconductor manufacturing

Cimino Mauro; Kaluarachchi Don Channa; Phi Son; Vishnuprasad Ramyashree; Lubomirsky 【我.爱.线.报.网.】Dmitry

11536708

Methods to fabricate dual pore devices

Saly Mark J.; Woods Keenan Navarre; Johnson Joseph R.; Bhuyan Bhaskar Jyoti; Durand William J.; Chudzik Michael; Sreenivasan Raghav; Quon Roger

11537040

Extreme ultraviolet mask blank hard mask materials

Liu Shuwei; Xiao Wen; Jindal Vibhu; Zerrade Aze【我.爱.线.报.网.】ddine

11537151

Multi-channel flow ratio controller and processing chamber

Bauer Matthias

11538654

Thermally isolated captive features for ion implantation systems

McLaughlin Adam M.; Tye Jordan B.

11538663

Methods and apparatus for processing a substrate

Poulose John; Ramaswamy Kartik

11538677

Systems and meth【我.爱.线.报.网.】ods for depositing high density and high tensile stress films

Yang Chuanxi; Yu Hang; Yang Yu; Wang Chuan Ying; Yau Allison; Han Xinhai; Kamath Sanjay G.; Padhi Deenesh

11538706

System and method for aligning a mask with a substrate

Lerner Alexander N.; Karazim Michael P.; Constant Andrew J.; Brodine Jef【我.爱.线.报.网.】frey A.; Vellore Kim Ramkumar; Moraes Kevin; Shaviv Roey

11538714

System apparatus and method for enhancing electrical clamping of substrates using photo-illumination

Chen Qin; Blake Julian G.; Osborne Michael W.; Anella Steven M.; Fischer Jonathan D.

11538925

Ion implantation to form step-oxide trench M【我.爱.线.报.网.】OSFET

Gu Sipeng; Zheng Yi; Zhang Qintao; Hautala John

11540432

Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Natu Gayatri; Bajaj Geetika; Goradia Prerna; Thakare Darshan; Fenwick David; He XiaoMing; Seppaelae Sanni; Sun Jennifer; Thanu Rajkumar; Hudgens Jeff; 【我.爱.线.报.网.】Muthukamatchy Karuppasamy; Dhayalan Arun